Surenoo Stp0240d1-240320 Series Tft Lcd Panel User Manual

Surenoo Stp0240d1-240320 Series Tft Lcd Panel User Manual

Surenoo STP0240D1-240320 Series TFT LCD Panel User Manual
Surenoo STP0240D1-240320 Series TFT LCD Panel

General Description

MODEL NOSTP0240D1-240320 YT240L008
Display ModeTransmissive
Display FormatGraphic 240RGB*320 Dot-matrix 240xRGBx320
Input Data4 Line-SPI/8bit/16bit  interface 4
Viewing Direction12 o’clock 12
DriveILI9341

Mechanical Specification

ItemSpecificationsUnit
Dimensional outline42.72(W)*60.26(H)*2.55(T)(NTP)42.72(W)*60.26(H)*3.75(T)(RTP)
(FPC not include)
mm
Resolution240RGB*320dots
LCD Active area36.72(W)*48.96 (H)mm
Pixel size0.153(W)*0.153(H)mm

Mechanical Dimension

Mechanical Dimension

Electrical Maximum Ratings

ItemSymbolMinMaxUnitNote
Supply voltagVDDIV1.83.3V
Supply voltageVDD )V2.83.3V
Operating temperatureTOPR-2070
Storage temperatureTSTR-3080

Brightness characteristic&Power dissipation

ItemSymbolMinTypicalMaxUnit
LED module Forward voltageVLED293.13.3V
LED module currentILED60mA
LCD Surface LuminanceLS250300Cd/m2
LCM Surface brightness uniformLD80%
LCD power dissipationPLCD0.22W

NOTE:PLCD=VDD * (ILED+ILCD)

Module Function Description

PIN No.SymbolDescriptionNotes
1XL(X-)Touch panel Logical foot
2YU(Y+)Touch panel Logical foot
3XR(X+)Touch panel Logical foot
4YD(Y+)Touch panel Logical foot
5GNDGround
6VDDIPower Supply for I/O System.
7VDDPower Supply for Analog, Digital System and Booster Circuit.
8TETearing effect signal is used to synchronize MCU to frame memory
9CSX/SPI CSX
  • Chip selection pin Low enable.
    High disable.
10DCX/SPI SCL
  • Display data/command selection pin in parallel interface.
  • This pin is used to be serial interface clock.
复用脚
11WRX/A0(SPI4) 
  • Write enable in MCU parallel interface.
  • Display data/command selection pin in 4-line serial interface.
复用脚
12RDX
  • Read enable in 8080 MCU parallel interface.
  • If not used, please fix this pin at VDDI or GND.
13SPI SDI/SDASPI interface input pin.
  • The data is latched on the rising edge of the SCL signal.
  • If not used, please fix this pin at VDDI or DGND level.
14SPI SDO
  • SPI interface output pin.
  • The data is output on the falling edge of the SCL signal.
  • If not used, let this pin open.
15RESX
  • This signal will reset the device and it must be applied to properly initialize the chip.
  • Signal is active low.
16GNDGround
17-24DB0-DB7MCU parallel interface data bus.
25-32DB8-DB15MCU parallel interface data bus.
33LED-AAnode of Backlight (2.9V-3.3V Typical:3.1V)
34-36LED-KCathode of Backlight
37GNDGround
38IM0-The MCU interface mode select.
39IM1
40IM2*NOTE:IM3

Wiring

Wiring InductionWiring InductionWiring InductionWiring Induction

Response time&Contrast ratio

ItemSymbolConditionRemarkUnit
Min.Typ.Max.
Response timeTr+Tfθ=0°2540ms
Contrast ratioCRθ=0°350500

Response time&Contrast ratio

Viewing Angle

ItemSymbolConditionRemarkUnit
Min.Typ.Max.
Viewing angleTop 12CR≥104050Deg.
Bottom 6CR≥105565
Left 9CR≥105565
Right 3CR≥105565

Viewing Angle

Reliability Trial

NO.ITEMCONDITIONCRITERION
1High Temperature Non-Operating Test80℃*120HrsNo Defect Of Operational Function In Room Temperature Are Allowable
2Low Temperature Non-Operating Test-30℃*120Hrs
3High Temperature/Humidity Non Operating Test60℃*90%RH*120Hrs
4High Temperature Operating Test70℃*72Hrs
5Low Temperature Operating Test-20℃*72Hrs
6Thermal Shock Test-20  ℃ (30Min) Q70  ℃ (30Min) *10CYCLES

Inspection standard

Glass defect
NODefect itemCriteriaRemark
1Dimension Unconformity (Major defect)By Engineering Drawing
2Cracks (Major defect)1.Linear cracks panel【Reject】

2. Nonlinear crack contrast by limited sample

Crack
3Glass extrude the conductive area (minor defect)a: disregards and no influence assemblage.
  1. b≤1/3Pin width(non bonding area)【Accept】
  2. bonding area≤0.5mm【Accept】
A: Length, b: Width
4Pin-side ,conductive area damaged (minor defect)(a c: disregards)

b≤1/3of effective length for bonding electrode【Accept】

a: length, b: Width, c: Thickness
Pin-side ,conductive area
damaged
5Pin-side,non-conductive area damaged (minor defect)1)  Damage area don’t touch the ITO (Inclueling contraposition mark, except scribing mark)

【Accept】

2)  C<T b≦BM1/3of width

【Accept】

3)  c=T

b not touch the seal glue

【Accept】

4)  a disregards

a: Length, b: Width c: Thickness
Pin-side,non-conductive
area damaged
6Non-pin-side damage (minor defect)c<T

1)b exceeds 1/3Bm

【Reject】

c=T

b not touch the seal glue

【Reject】

c: Thickness b: width of damage
Non-pin-side damage
LCD appearance defect(View area)
NODefect itemCriteriaRemark
1Fiber glass cratch polarizer scratch/folded (minor defect)SpecificationAllowablenote1:L: Length, W: Width note2: disregard if out of AA
LCD appearance defect

 

 

W≦0.03mmdisregard
0.03mm<W≦0.05mm;
L≦3.0mm
2
0.05mm<W≦0.1mm; L≦3.0mm1
W>0.1mm;L>3.0mm0
2Polarizer bubble、concave and convex (minor defect)φ≦0.2mmdisregardnote1: φ=(L+W)/2,L:Length, W :Width
note2:disregard if out of AA
0.2mm<φ≦0.3mm2
0.3mm<φ≦0.5mm1
0.5mm<φ0
3Black dots dirty dots impurities eye winker (minor defect)φ≦0.15mmdisregardnote2:disregard if out of AA
LCD appearance defect
0.15mm<φ≦0.25mm2
0.25mm<φ≦0.3mm1
0.3mm<φ0
4Polarizer prick (minor defect)φ≦0.1mmdisregardnote1: φ=(L+W)/2,L=Length,
W=Width
note2:the distance between two dots>5mm
0.1mm<φ≦0.25mm3
φ>0.25mm0

Package Method

Package Method

 

References

Documents / Resouces

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