Surenoo Stp0280d1-240320 Series Tft Lcd Panel User Manual

Surenoo Stp0280d1-240320 Series Tft Lcd Panel User Manual

STP0280D1-240320 Series TFT LCD Panel

OLOGY CO.,LTD.

 A3 Model No.: STP0280D1-240320 

STP0280D1-240320 Series
TFT LCD PANEL USER MANUAL  

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Shenzhen Surenoo Technology Co.,Ltd.
www.surenoo.com 
Skype: Surenoo365

Reference Controller Datasheet
TFT LCD Panel Selection Guide
ILI9341

www.surenoo.com 

1. General Description

MODEL NOSTP0280D1-240320 YT280L008
Display ModeTransmissive
Display FormatGraphic 240R
1.General Description
Input Data4 Line-SPI/8bit
Viewing Direction12 o’clock
DriveILI9341

2. Mechanical Specification

ItemSpecificationsUnit
Dimensional outline50.00(W)*69.20(H)*2.60(T)(NTP)
50.00(W)*69.20(H)*3.80(T)(RTP)
(FPC not include)
mm
Resolution240RGB*320dots
LCD Active area36.72(W)*48.96 (H)mm
Pixel size0.153(W)*0.153(H)mm

3.Mechanical Dimension

diagram

NOTES:
1.DISPLAY TYPE:TFT
2.OPERATING TEMP: -20°C~70°C
3.STORAGE TEMP: -30°C~80°C
4.LCD DRIVER: COG(IC:ILI9341V);
5.BACKLIGHT: 4 CHIP-WHITE LED(Parellel)
6.GENERAL TOLERANCE:±0.20
7.ROHS

circuit diagram

CIRCUIT DIAGRAM

4. Electrical Maximum Ratings

ItemSymbolMinMaxUnitNote
Supply voltage(VDDI)V1.83.3V
Supply voltage(VDD)V2.83.3V
Operating temperatureTOPR-2070
Storage temperatureTSTR-3080

5. Brightness characteristic & Power dissipation

ItemSymbolMinTypicalMaxUnit
LED module Forward voltageVLED2.93.13.3V
LED module currentILED60mA
LCD Surface LuminanceLS250300Cd/m2
LCM Surface brightness uniformLD80%
LCD power dissipationPLCD0.22W

NOTE: PLCD=VDD * (ILED+ILCD)

6. Module Function Description

PIN No.SymbolDescription
panel Logical foot
Notes
1XL(X-)Touch panel Logical foot
2YU(Y+)Touch panel Logical foot
3XR(X+)Touch panel Logical foot
4YD(Y+)Touch panel Logical foot
5GNDGround
6VDDIPower Supply for I/O System.
7VDDPower Supply for Analog, Digital System and Booster
Circuit.
8TETearing effect signal is used to synchronize MCU to frame
memory
9DCX/SPI SCL-Chip selection pin
Low enable.
High disable.
10DCX/SPI SCL
-Display data/command selection pin in parallel
interface. -This pin is used to be serial interface clock.
11WRX/A0(SPI4)
-Write enable in MCU parallel interface. – Display data/command selection pin in 4-line serial
interface.
12RDX-If not used, please fix this pin at VDDI or GND.
-Read interface input pin.
13SPI SDI/SDASPI interface input pin.
-The data is latched on the rising edge of the SCL signal.
-If not used, please fix this pin at VDDI or DGND level.
14SPI SDO-SPI interface output pin.
-The data is output on the falling edge of the SCL signal.
-If not used, let this pin open.
15RESX-This signal will reset the device and it must be applied
to properly initialize the chip.
-Signal is active low.
16GNDGround
17-24DB0-DB7MCU parallel interface data bus.
25-32DB8-DB15MCU parallel interface data bus.
33LED-AAnode of Backlight (2.9V-3.3V Typical:3.1V)
34-36LED-KCathode of Backlight
37GNDGround
38
39
40
IM0-The MCU interface mode select.
IM1mcu
IM2*NOTE:

STP0280D1 MCU-16

diagram list

6-1: STP0280D1 MCU-8

diagram parts

6-2 STP0280D1 4-W SPI

parts

6-3

parts dd

7.Response time & Contrast ratio

Item
Symbol
Condition
Remark
Unit
Min.Typ.Max.
Response timeTr+Tfθ=0°2540ms
Contrast ratioCRθ=0°350500

white diagram

contrast

8. Viewing Angle

Item
Symbol
Condition
Remark
Unit
Min.Typ.Max.
Viewing
angle
TopCR≥104050
Deg.
BottomCR≥105565
LeftCR≥105565
RightCR≥105565

9. Reliability Trial

NO.ITEMCONDITIONCRITERION
1High Temperature Non-Operating Test80℃*120Hrs
No Defect Of
Operational
Function In Room
Temperature Are
Allowable
2Low Temperature Non-Operating Test-30℃*120Hrs Remark
3High Temperature/Humidity Non Operating Test60℃*90%RH*120Hrs
4High Temperature Operating Test70℃*72Hrs
5Low Temperature Operating Test-20℃*72Hrs℃ (30Min)
6Thermal Shock Test-20 Q70℃(30Min) *10CYCLES

10.Inspection standards

10.1Glass defect

NODefect itemCriteriaRemark
1Dimension
Unconformity
(Major defect)
By Engineering Drawing
2Cracks
(Major defect)
1. Linear cracks panel
【Reject】
2. Nonlinear crack contrast by
limited sample
linear
3Glass extrude the
conductive area
(minor defect)
a: disregards and no influence
assemblage.
1) b≤1/3Pin width(non bonding
area)
【Accept】
2)bonding area≤0.5mm
【Accept】
A: Length, b: Width
4Pin-side ,conductive area
damaged
(minor defect)
(a c: disregards)
b≤1/3of effective length for
bonding electrode
【Accept】
a: length, b: Width, c: Thickness
lenght
5Pin-side,non-conductive
area damaged
(minor defect)
1)Damage area don’t touch the ITO
(Inclueling contraposition mark,
except scribing mark)
【Accept】
2)C<T b≦BM1/3of width
【Accept】
3)c=T
b not touch the seal glue
【Accept】
4)a disregards
a: Length, b: Width c: Thickness
width
6Non-pin-side damage
(minor defect)
c<T
1)b exceeds 1/3Bm
【Reject】
c=T
b not touch the seal glue
【Reject】
c: Thickness b: width of damage
damage

10.2LCD appearance defect(View area)

NODefect itemCriteriaRemark
1
Fiber、glassSpecificationAllowable
note2:disregard if out of AA note2:disregard if out of AA
length diagram
cratch、polarizerW≦0.03mmdisregard
scratch/folded0.03mm<W≦0.05mm;
L≦3.0mm
2 disregard
(minor defect)0.05mm<W≦0.1mm; L≦3.0mm1
W>0.1mm;L>3.0mm
2
、Polarizer bubble、
concave and convex
(minor defect)
φ≦0.2mmdisregard
note1: φ=(L+W)/2,L:Length,
W :Width
note2:disregard if out of AA
0.2mm<φ≦0.3mm2
0.3mm<φ≦0.5mm1
0.5mm<φ φ≦0
3Black dots、dirty dots、0.15mmdisregard
note2:disregard if out of AA
impurities、eye winker
(minor defect)
0.15mm<φ≦0.25mm2
0.25mm<φ≦0.3mm1
0.3mm<φ0
4
Polarizer prick
(minor defect)
φ≦0.1mm
note1: φ=(L+W)/2,L=Length,
W=Width
note2:the distance between two
dots>5mm
0.1mm<φ≦0.25mm
φ>0.25mm

11.Package Method

parts box

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References

Documents / Resouces

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