Surenoo STP0320D2-240320 Series TFT LCD Panel User Manual
General Description
| MODEL NO | STP0320D2-240320 YT320L008 |
| Display Mode | Transmissive |
| Display Format | Graphic 240RGB*320 Dot-matrix 240xRGBx320 |
| Input Data | 4 Line-SPI/8bit/16bit interface |
| Viewing Direction | 12 o’clock 12 |
| Drive | ST7789V |
Mechanical Specification
| Item | Specifications | Unit |
| Dimensional outline | 54.00(W)*77.40(H)*2.40(T)（NTP）54.00(W)*77.40(H)*3.70(T)（RTP）(FPC not include) | mm |
| Resolution | 240RGB*320 | dots |
| LCD Active area | 48.60(W)*64.80 (H) | mm |
| Pixel size | 0.2025W)*0.2025(H) | mm |
.Mechanical DimensioN
Electrical Maximum Rating
| Item | Symbol | Min | Max | Unit | Note |
| Supply voltage（VDDI） | V | 1.8 | 3.3 | V | – |
| Supply voltage（VDD） | V | 2.8 | 3.3 | V | – |
| Operating temperature | TOPR | -20 | 70 | ℃ | – |
| Storage temperature | TSTR | -30 | 80 | ℃ | – |
Brightness characteristic&Power dissipation
| Item | Symbol | Min | Typical | Max | Unit |
| LED module Forward voltage | VLED | 2．9 | 3.1 | 3.3 | V |
| LED module current | ILED | – | 90 | – | mA |
| LCD Surface Luminance | LS | 330 | 350 | – | Cd/m2 |
| LCM Surface brightness uniform | LD | 80 | – | – | % |
| LCD power dissipation | PLCD | – | 0.32 | – | W |
Module Function Description
| PIN No. | Symbol | Description | Notes |
| 1 | XL(X-) | Touch panel Logical foot | – |
| 2 | YU(Y+) | Touch panel Logical foot | – |
| 3 | XR(X+) | Touch panel Logical foot | – |
| 4 | YD(Y+) | Touch panel Logical foot | – |
| 5 | GND | Ground | – |
| 6 | VDDI | Power Supply for I/O System. | – |
| 7 | VDD | Power Supply for Analog, Digital System and Booster Circuit. | – |
| 8 | TE | Tearing effect signal is used to synchronize MCU to frame | – |
| 9 | CSX/SPI CSX | -Chip selection pin Low enable.High disable. | – |
| 10 | DCX/SPI SCL | -Display data/command selection pin in parallel interface. -This pin is used to be serial interface clock. | |
| 11 | WRX/A0(SPI4) | – Display data/command selection pin in 4-line serial interface. |
| 12 | RDX | -Read enable in 8080 MCU parallel interface.-If not used, please fix this pin at VDDI or GND. ( | – |
| 13 | SPI SDI/SDA | SPI interface input pin.-The data is latched on the rising edge of the SCL signal.-If not used, please fix this pin at VDDI or DGND level. | – |
| 14 | SPI SDO | -SPI interface output pin.-The data is output on the falling edge of the SCL signal.-If not used, let this pin open. | – |
| 15 | RESX | -This signal will reset the device and it must be applied to properly initialize the chip.-Signal is active low. | – |
| 16 | GND | Ground | – |
| 17-24 | DB0-DB7 | MCU parallel interface data bus. | – |
| 25-32 | DB8-DB15 | MCU parallel interface data bus. | – |
| 33 | LED-A | Anode of Backlight (2.9V-3.3V Typical:3.1V) | – |
| 34-36 | LED-K | Cathode of Backlight | – |
| 37 | GND | Ground | – |
| 38 | IM0 | -The MCU interface mode select. | – |
| 39 | IM1 | – | |
| 40 | IM2 | – |
STP0320D2 MCU-16
STP0320D2 MCU-8
STP0320D2 4-W SPI
| Item | Symbol | Condition | Remark | Unit | ||
| Min. | Typ. | Max. | ||||
| Response time | Tr+Tf | θ=0° | – | 25 | 40 | ms |
| Contrast ratio | CR | θ=0° | 350 | 500 | – | – |
Viewing Angle
| Item | Symbol | Condition | Remark | Unit | ||
| Min. | Typ. | Max. | ||||
| Viewing angle | Top | CR≥10 | 40 | 50 | – | Deg. |
| Bottom | CR≥10 | 55 | 65 | – | ||
| Left | CR≥10 | 55 | 65 | – | ||
| Right | CR≥10 | 55 | 65 | – | ||
| NO. | ITEM | CONDITION | CRITERION |
| 1 | High Temperature Non-Operating Test | 80℃*120Hrs | No Defect Of |
| Operational | |||
| 2 | Low Temperature Non-Operating Test | -30℃*120Hrs | Function In Room |
| Temperature Are | |||
| 3 | High Temperature/Humidity Non Operating Test | 60℃*90%RH*120Hrs | Allowable |
| 4 | High Temperature Operating Test | 70℃*72Hrs | |
| 5 | Low Temperature Operating Test | -20℃*72Hrs | |
| 6 | Thermal Shock Test | -20 ℃ (30Min) Q70 ℃ | |
| (30Min) *10CYCLES |
.Inspection standard
| NO | Defect item | Criteria | Remark |
| 1 | Dimension Unconformity(Major defect) | By Engineering Drawing | |
| 2 | Cracks(Major defect) | 1. Linear cracks panel【Reject】2. Nonlinear crack contrast by limited sample |  |
| 3 | Glass extrude the conductive area(minor defect) | a: disregards and no influence assemblage.1) b≤1/3Pin width(non bonding area)【Accept】2) bonding area≤0.5mm【Accept】 | A: Length, b: Width |
|
4 | Pin-side ,conductive area damaged(minor defect) | (a c: disregards)b≤1/3of effective length for bonding electrode【Accept】 | a: length, b: Width, c: Thickness |
| 5 | Pin-side,non-conductive area damaged(minor defect) | 1) Damage area don’t touch the ITO (Inclueling contraposition mark, except scribing mark)【Accept】2) C<T b≦BM1/3of width【Accept】3) c=Tb not touch the seal glue【Accept】4) a disregards | a: Length, b: Width c: Thickness
|
| 6 | Non-pin-side damage(minor defect) | c<T1)b exceeds 1/3Bm【Reject】c=Tb not touch the seal glue【Reject】 | c: Thickness b: width ofdamage
|
LCD appearance defect(View area)
| NO | Defect item | Criteria | Remark | |
| 1 | Fiber、glass cratch、polarizer scratch/folded(minor defect) | Specification | Allowable | note1:L: Length, W: Width note2: disregard if out of AA |
| W≦0.03mm | disregard | |||
| 0.03mm<W≦0.05mm;L≦3.0mm | 2 | |||
| 0.05mm<W≦0.1mm;L≦3.0mm | 1 | |||
| W>0.1mm;L>3.0mm | 0 | |||
| 2 | Polarizer bubble、concave and convex(minor defect) | φ≦0.2mm | disregard | note1: φ=(L+W)/2,L:Length,W :Widthnote2:disregard if out of AA |
| 0.2mm<φ≦0.3mm | 2 | |||
| 0.3mm<φ≦0.5mm | 1 | |||
| 0.5mm<φ | 0 | |||
| 3 | Black dots、dirty dots、 | φ≦0.15mm | disregard | note2:disregard if out of AA |
| impurities、eye winker(minor defect) | 0.15mm<φ≦0.25mm | 2 |  | |
| 0.25mm<φ≦0.3mm | 1 | |||
| 0.3mm<φ | 0 | |||
| 4 | Polarizer prick(minor defect) | φ≦0.1mm | disregard | note1: φ=(L+W)/2,L=Length,W=Widthnote2:the distance between two dots>5mm |
| 0.1mm<φ≦0.25mm | 3 | |||
| φ>0.25mm | 0 |
Package Method
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