VISHAY TO-247 Power MOSFET
Power MOSFET
| PRODUCT SUMMARY | ||
| VDS (V) | 500 | |
| RDS(on) (W) | VGS = 10 V | 0.40 |
| Qg (Max.) (nC) | 150 | |
| Qgs (nC) | 20 | |
| Qgd (nC) | 80 | |
| Configuration | Single | |
FEATURES
- Dynamic dV/dt Rating
- Repetitive Avalanche Rated
- Isolated Central Mounting Hole
- Fast Switching
- Ease of Paralleling
- Simple Drive Requirements
- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because its isolated mounting hole.
It also provides greater creepage distances between pins to meet the requirements of most safety specifications.
| ORDERING INFORMATION | |
| Package | TO-247 |
| Lead (Pb)-free | IRFP450PbF |
| ABSOLUTE MAXIMUM RATINGS TC= 25 °C, unless otherwise noted | |||||
| PARAMETER | SYMBOL | LIMIT | UNIT | ||
| Drain-Source Voltage | VDS | 500 | V | ||
| Gate-Source Voltage | VGS | ± 20 | |||
| Continuous Drain Current | VGS at 10 V | TC = 25 °C | ID | 14 | A |
| TC = 100 °C | 8.7 | ||||
| Pulsed Drain Currenta | IDM | 56 | |||
| Linear Derating Factor | 1.5 | W/°C | |||
| Single Pulse Avalanche Energyb | EAS | 760 | mJ | ||
| Repetitive Avalanche Currenta | IAR | 8.7 | A | ||
| Repetitive Avalanche Energya | EAR | 19 | mJ | ||
| Maximum Power Dissipation | TC = 25 °C | PD | 190 | W | |
| Peak Diode Recovery dV/dtc | dV/dt | 3.5 | V/ns | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | – 55 to + 150 | °C | ||
| Soldering Recommendations (Peak Temperature) | for 10 s | 300d | |||
| Mounting Torque | 6-32 or M3 screw | 10 | lbf · in | ||
| 1.1 | N · m | ||||
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 50 V, starting TJ = 25 °C, L = 7.0 mH, RG = 25 Ω, IAS = 14 A (see fig. 12)
c. ISD ≤ 14 A, dI/dt ≤ 130 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
| THERMAL RESISTANCE RATINGS | ||||
| PARAMETER | SYMBOL | TYP. | MAX. | UNIT |
| Maximum Junction-to-Ambient | RthJA | – | 40 | °C/W |
| Case-to-Sink, Flat, Greased Surface | RthCS | 0.24 | – | |
| Maximum Junction-to-Case (Drain) | RthJC | – | 0.65 | |
| SPECIFICATIONS TJ= 25 °C, unless otherwise noted | |||||||
| PARAMETER | SYMBOL | TEST CONDITIONS | MIN. | TYP. | MAX. | UNIT | |
| Static | |||||||
| Drain-Source Breakdown Voltage | VDS | VGS = 0 V, ID = 250 μA | 500 | – | – | V | |
| VDS Temperature Coefficient | DVDS/TJ | Reference to 25 °C, ID = 1 mA | – | 0.63 | – | V/°C | |
| Gate-Source Threshold Voltage | VGS(th) | VDS = VGS, ID = 250 μA | 2.0 | – | 4.0 | V | |
| Gate-Source Leakage | IGSS | VGS = ± 20 V | – | – | ± 100 | nA | |
| Zero Gate Voltage Drain Current | IDSS | VDS = 500 V, VGS = 0 V | – | – | 25 | μA | |
| VDS = 400 V, VGS = 0 V, TJ = 125 °C | – | – | 250 | ||||
| Drain-Source On-State Resistance | RDS(on) | VGS = 10 V | ID = 8.4 Ab | – | – | 0.40 | W |
| Forward Transconductance | gfs | VDS = 50 V, ID = 8.4 Ab | 9.3 | – | – | S | |
| Dynamic | |||||||
| Input Capacitance | Ciss | VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 | – | 2600 | – | pF | |
| Output Capacitance | Coss | – | 720 | – | |||
| Reverse Transfer Capacitance | Crss | – | 340 | – | |||
| Total Gate Charge | Qg | VGS = 10 V | ID = 14 A, VDS = 400 V, see fig. 6 and 13b | – | – | 150 | nC |
| Gate-Source Charge | Qgs | – | – | 20 | |||
| Gate-Drain Charge | Qgd | – | – | 80 | |||
| Turn-On Delay Time | td(on) |
VDD = 250 V, ID = 14 A, RG = 6.2 W, RD = 17 W, see fig. 10b | – | 17 | – |
ns | |
| Rise Time | tr | – | 47 | – | |||
| Turn-Off Delay Time | td(off) | – | 92 | – | |||
| Fall Time | tf | – | 44 | – | |||
| Internal Drain Inductance | LD | Between lead, D 6 mm (0.25″) from package and center of G die contact S | – | 5.0 | – | nH | |
| Internal Source Inductance | LS | – | 13 | – | |||
| Drain-Source Body Diode Characteristics | |||||||
| Continuous Source-Drain Diode Current | IS | MOSFET symbol D showing the integral reverse G p – n junction diode S | – | – | 14 | A | |
| Pulsed Diode Forward Currenta | ISM | – | – | 56 | |||
| Body Diode Voltage | VSD | TJ = 25 °C, IS = 14 A, VGS = 0 Vb | – | – | 1.4 | V | |
| Body Diode Reverse Recovery Time | trr | TJ = 25 °C, IF = 14 A, dI/dt = 100 A/μsb | – | 540 | 810 | ns | |
| Body Diode Reverse Recovery Charge | Qrr | – | 4.8 | 7.2 | μC | ||
| Forward Turn-On Time | ton | Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) | |||||
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?91233.
TO-247AC (High Voltage)
VERSION 1: FACILITY CODE = 9
| MILLIMETERS | |||
| DIM. | MIN. | MAX. | NOTES |
| A | 4.83 | 5.21 | |
| A1 | 2.29 | 2.55 | |
| A2 | 1.50 | 2.49 | |
| b | 1.12 | 1.33 | |
| b1 | 1.12 | 1.28 | |
| b2 | 1.91 | 2.39 | 6 |
| b3 | 1.91 | 2.34 | |
| b4 | 2.87 | 3.22 | 6, 8 |
| b5 | 2.87 | 3.18 | |
| c | 0.55 | 0.69 | 6 |
| c1 | 0.55 | 0.65 | |
| D | 20.40 | 20.70 | 4 |
| MILLIMETERS | |||
| DIM. | MIN. | MAX. | NOTES |
| D1 | 16.25 | 16.85 | 5 |
| D2 | 0.56 | 0.76 | |
| E | 15.50 | 15.87 | 4 |
| E1 | 13.46 | 14.16 | 5 |
| E2 | 4.52 | 5.49 | 3 |
| e | 5.44 BSC | ||
| L | 14.90 | 15.40 | |
| L1 | 3.96 | 4.16 | 6 |
| Ø P | 3.56 | 3.65 | 7 |
| Ø P1 | 7.19 ref. | ||
| Q | 5.31 | 5.69 | |
| S | 5.54 | 5.74 | |
Notes
- Package reference: JEDEC® TO247, variation AC
- All dimensions are in mm
- Slot required, notch may be rounded
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm
- Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4 dimension at maximum material condition
VERSION 2: FACILITY CODE = Y
| MILLIMETERS | |||
| DIM. | MIN. | MAX. | NOTES |
| A | 4.58 | 5.31 | |
| A1 | 2.21 | 2.59 | |
| A2 | 1.17 | 2.49 | |
| b | 0.99 | 1.40 | |
| b1 | 0.99 | 1.35 | |
| b2 | 1.53 | 2.39 | |
| b3 | 1.65 | 2.37 | |
| b4 | 2.42 | 3.43 | |
| b5 | 2.59 | 3.38 | |
| c | 0.38 | 0.86 | |
| c1 | 0.38 | 0.76 | |
| D | 19.71 | 20.82 | |
| D1 | 13.08 | – | |
| MILLIMETERS | |||
| DIM. | MIN. | MAX. | NOTES |
| D2 | 0.51 | 1.30 | |
| E | 15.29 | 15.87 | |
| E1 | 13.72 | – | |
| e | 5.46 BSC | ||
| Ø k | 0.254 | ||
| L | 14.20 | 16.25 | |
| L1 | 3.71 | 4.29 | |
| Ø P | 3.51 | 3.66 | |
| Ø P1 | – | 7.39 | |
| Q | 5.31 | 5.69 | |
| R | 4.52 | 5.49 | |
| S | 5.51 BSC | ||
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994
- Contour of slot optional
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
- Outline conforms to JEDEC outline TO-247 with exception of dimension c
VERSION 3: FACILITY CODE = N
| MILLIMETERS | MILLIMETERS | |||||
| DIM. | MIN. | MAX. | DIM. | MIN. | MAX. | |
| A | 4.65 | 5.31 | D2 | 0.51 | 1.35 | |
| A1 | 2.21 | 2.59 | E | 15.29 | 15.87 | |
| A2 | 1.17 | 1.37 | E1 | 13.46 | – | |
| b | 0.99 | 1.40 | e | 5.46 BSC | ||
| b1 | 0.99 | 1.35 | k | 0.254 | ||
| b2 | 1.65 | 2.39 | L | 14.20 | 16.10 | |
| b3 | 1.65 | 2.34 | L1 | 3.71 | 4.29 | |
| b4 | 2.59 | 3.43 | N | 7.62 BSC | ||
| b5 | 2.59 | 3.38 | P | 3.56 | 3.66 | |
| c | 0.38 | 0.89 | P1 | – | 7.39 | |
| c1 | 0.38 | 0.84 | Q | 5.31 | 5.69 | |
| D | 19.71 | 20.70 | R | 4.52 | 5.49 | |
| D1 | 13.08 | – | S | 5.51 BSC | ||
| ECN: E20-0545-Rev. F, 19-Oct-2020 DWG: 5971 | ||||||
Notes
- Dimensioning and tolerancing per ASME Y14.5M-1994
- Contour of slot optional
- Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005″) per side. These dimensions are measured at the outermost extremes of the plastic body
- Thermal pad contour optional with dimensions D1 and E1
- Lead finish uncontrolled in L1
- Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154″)
Disclaimer
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Revision: 01-Jan-2022
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