Vishay Irfbg30 Power Mosfet Instruction Manual

Vishay Irfbg30 Power Mosfet Instruction Manual

VISHAY logoIRFBG30 Power MOSFET
Instruction ManualVISHAY IRFBC40A Power MOSFET

IRFBG30 Power MOSFET

VISHAY IRFBC40A Power MOSFET fig 7

PRODUCT SUMMARY

VDS M1000
RDS(on) (Ω)Vas = 10 V5.0
Qg max. (nC)80
Qgs (nC)10
Qgd (nC)42
ConfigurationSingle

FEATURES

  • Dynamic dV/dt rating
  • Repetitive avalanche rated
  • Fast switching
    VISHAY IRFBG30 Power MOSFET icon
  • Ease of paralleling
  • Simple drive requirements
  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Note
* This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information/tables in this datasheet for details

DESCRIPTION

Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The TO-220AB package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220AB contribute to its wide acceptance throughout the industry.

ORDERING INFORMATION

PackageTO-220AB
Lead (Pb)-freeIRFBG30PbF
Lead (Pb)-free and halogen-freeIRFBG30PbF-BE3

ABSOLUTE MAXIMUM RATINGS

(TC = 25 °C, unless otherwise noted)

PARAMETERSYMBOLLIMITUNIT
Drain-source voltageVDS1000V
Gate-source voltageVas± 20
Continuous drain currentVas at 10 VTc = 25 °CID3.A
Tc = 100 °C2.0
Pulsed drain current aIPM12
Linear derating factor1.0W/°C
Single pulse avalanche energy bEAS280mJ
Repetitive avalanche current aIAR3.A
Repetitive avalanche energy aEAR13mJ
Maximum power dissipationTc = 25 °CPD125W
Peak diode recovery dV/dt °dV/dt1.0V/ns
Operating junction and storage temperature rangeTj, Tstg-55 to +150°C
Soldering recommendations (peak temperature) dFor 10 s300
Mounting torque6-32 or M3 screw10lbf • in
1.N • m

Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 50 V, starting TJ = 25 °C, L = 55 mH, Rg = 25 Ω, IAS = 3.1 A (see fig. 12)
c. ISD ≤ 3.1 A, dI/dt ≤ 80 A/μs, VDD ≤ 600, TJ ≤ 150 °C
d. 1.6 mm from case

THERMAL RESISTANCE RATINGS

PARAMETERSYMBOLTYP.MAX.UNIT
Maximum junction-to-ambientRthJA62°C/W
Case-to-sink, flat, greased surfaceRthcs0.50
Maximum junction-to-case (drain)RthJC1.0

SPECIFICATIONS

(TJ = 25 °C, unless otherwise noted)

PARAMETERSYMBOLTEST CONDITIONSMIN.TYP.MAX.UNIT
Static
Drain-source breakdown voltageVDSVGS = 0 V, ID = 250 pA1000V
VDS temperature coefficientAVDs/T jReference to 25 °C, ID = 1 mA1.V/°C
Gate-source threshold voltageVGS(th)VDS = VGS, ID = 250 pA2.04.0V
Gate-source leakageIGSSVGS = ± 20 V± 100nA
Zero gate voltage drain currentlossVDS = 1000 V, VGS = 0 V100pA
VDS = 800 V, VGS = 0 V, Tj = 125 °C500
Drain-source on-state resistanceRDS(on)Vcs = 10 VI ID = 1.9 A b5.0S2
Forward transconductanceglsVDS = 10 V, ID = 1.9 A bS
Dynamic
Input capacitanceCissVcs = 0 V,
VDS = 25 V,
f = 1. 5 see fi
1.0 MHz, fig.
980of
Output capacitanceCoss140
Reverse transfer capacitanceCrss50
Total gate chargeQgVGS = 10 VID = 3.1 A, VDS =400 V, see fig. 6 and 13 b80nC
Gate-source chargeOgs10
Gate-drain chargeOgd42
Turn-on delay timetd(on)VDD = 500 V, ID = 3.1 A
Ftg = 12 12, RD = 170 Q, see fig. 10 b
12
Rise timetr25
Turn-off delay timetd(oft)89_
Fall time29
Gate input resistanceFigf = 1 MHz, open drain0.-12.52
Internal drain inductanceLDBetween lead,
6 mm (0.25′) from package and center die contact
5nH
of
Internal source inductanceLs8.
Drain-Source Body Diode Characteristics
Continuous source-drain diode currentIsMOSFET symbol showing the integral reverse3.A
p – n junction diode
Pulsed diode forward current aIsm12
Body diode voltageVsDTj = 25 °C, Is = 3.1 A, VGs=0Vb2.V
Body diode reverse recovery timetrrTj = 25 °C, IF = 3.1 A, dl/dt = 100 A/ps b410620ns
Body diode reverse recovery chargeQrr1.2.0pC
Forward turn-on timetonIntrinsic turn-on time is negligible (turn-on is dominated by Ls and LS

Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %

TYPICAL CHARACTERISTICS

(25 °C, unless otherwise noted)VISHAY IRFBG30 Power MOSFET fig 1VISHAY IRFBG30 Power MOSFET fig 2VISHAY IRFBG30 Power MOSFET fig 3VISHAY IRFBG30 Power MOSFET fig 4VISHAY IRFBG30 Power MOSFET fig 5

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?91124.

Package Information

Vishay Siliconix TO-220-1VISHAY IRFBC40A Power MOSFET fig 1

DIM.MILLIMETERSINCHES
MIN.MAX.MIN.MAX.
A4.5.0.1670.183
b0.691.0.0270.040
b(1)1.2.0.0450.070
c0.360.610.0140.024
D14.16.0.5640.624
E10.11.0.3920.414
e2.3.0.0950.105
e(1)5.5.0.1920.208
F1.1.400.0450.055
1-1(1)6.107.0.2400.264
J(1)2.3.0.0950.115
L13.14.400.5260.567
L(1)3.4.0.1310.159
0 P4.4.0.1390.155
03.3.000.1000.118
ECN: E21-0621-Rev. D, 04-Nov-2021 DWG: 6031

Note
• M* = 0.052 inches to 0.064 inches (dimension including protrusion), heatsink hole for HVM

Disclaimer

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ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

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ALL RIGHTS RESERVED
Revision: 01-Jan-2022
Downloaded from Arrow.com.
Document Number: 91000

References

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