Surenoo St7789v Tft Lcd Panel User Manual (+ PDF)

Contents hide

1 Surenoo ST7789V TFT LCD Panel

2 General Description

3 Mechanical Specification

4 Mechanical Dimension

5 Module Function Description

6 Inspection standards

7 Package Method

8 Documents / Resources

8.1 References

9 Related Posts

Surenoo ST7789V TFT LCD Panel

Please click the following image to buy the sample

Shenzhen Surenoo Technology Co.,Ltd.
www.surenoo.com
Skype: Surenoo365

General Description

MODEL NO	STP0240D2-240320 YT240L008
Display Mode	Transmissive
Display Format	Graphic 240RGB*320 Dot-matrix 240xRGBx320
Input Data	4 Line-SPI/8bit/16bit interface 4
Viewing Direction	12 o’clock
Drive	ST7789V

Mechanical Specification

Item	Specifications	Unit
Dimensional outline	42.72(W)60.26(H)2.55(T)（NTP） 42.72(W)60.26(H)3.75(T)（RTP） (FPC not include)	mm
Resolution	240RGB*320	dots
LCD Active area	36.72(W)*48.96 (H)	mm
Pixel size	0.153(W)*0.153(H)	mm

Mechanical Dimension

Electrical Maximum Ratings

Item	Symbol	Min	Max	Unit	Note
Supply voltage（VDDI）	V	1.8	3.3	V	–
Supply voltage（VDD）	V	2.8	3.3	V	–
Operating temperature	TOPR	-20	70	℃	–
Storage temperature	TSTR	-30	80	℃	–

Brightness characteristic & Power dissipation

Item	Symbol	Min	Typical	Max	Unit
LED module Forward voltage	VLED	2．9	3.1	3.3	V
LED module current	ILED	–	60	–	mA
LCD Surface Luminance	LS	250	300	–	Cd/m2
LCM Surface brightness uniform	LD	80	–	–	%
LCD power dissipation	PLCD	–	0.22	–	W

NOTE:PLCD=VDD * (ILED+ILCD)

Module Function Description

PIN No.	Symbol	Description	Notes
1	XL(X-)	Touch panel Logical foot	–
2	YU(Y+)	Touch panel Logical foot	–
3	XR(X+)	Touch panel Logical foot	–
4	YD(Y+)	Touch panel Logical foot	–
5	GND	Ground	–
6	VDDI	Power Supply for I/O System. （ I/O 1.8-3.3V)	–
7	VDD	Power Supply for Analog, Digital System and Booster Circuit.（ 2.8-3.3V)	–
8	TE	Tearing effect signal is used to synchronize MCU to frame memory	–
9	CSX/SPI CSX	-Chip selection pin Low enable. High disable.	–
10	DCX/SPI SCL	-Display data/command selection pin in parallel interface. -This pin is used to be serial interface clock.
11	WRX/A0(SPI4)	-Write enable in MCU parallel interface. – Display data/command selection pin in 4-line serial interface.

12	RDX	-Read enable in 8080 MCU parallel interface. -If not used, please fix this pin at VDDI or GND.	–
13	SPI SDI/SDA	SPI interface input pin. -The data is latched on the rising edge of the SCL signal. -If not used, please fix this pin at VDDI or DGND level. （4 -SPI ，VDDI GND）	–
14	SPI SDO	-SPI interface output pin. -The data is output on the falling edge of the SCL signal. -If not used, let this pin open. （4 SPI	–
15	RESX	-This signal will reset the device and it must be applied to properly initialize the chip. -Signal is active low.	–
16	GND	Ground	–
17-24	DB0-DB7	MCU parallel interface data bus. MCU 8	–
25-32	DB8-DB15	MCU parallel interface data bus. MCU 8	–
33	LED-A	Anode of Backlight (2.9V-3.3V Typical:3.1V) （2.9-3.3V,:3.1V）	–
34-36	LED-K	Cathode of Backlight	–
37	GND	Ground	–
38	IM0	-The MCU interface mode select.	–
39	IM1		–
40	IM2	*NOTE，IM3	–

STP0240D2 MCU-16

STP0240D2 MCU-8

STP0240D2 4-W SPI

Response time & Contrast ratio

Item	Symbol	Condition	Remark			Unit
Item	Symbol	Condition	Min.	Typ.	Max.	Unit
Response time	Tr+Tf	θ=0°	–	25	40	ms
Contrast ratio	CR	θ=0°	350	500	–	–

Viewing Angle

Item	Symbol	Condition	Remark			Unit
Item	Symbol	Condition	Min.	Typ.	Max.	Unit
Viewing angle	Top 12	CR≥10	40	50	–	Deg.
	Bottom 6	CR≥10	55	65	–
	Left 9	CR≥10	55	65	–
	Right 3	CR≥10 10	55	65	–

Reliability Trial

NO.	ITEM	CONDITION	CRITERION
1	High Temperature Non-Operating Test	80℃*120Hrs	No Defect Of Operational Function In Room Temperature Are Allowable

2	Low Temperature Non-Operating Test	-30℃*120Hrs

3	High Temperature/Humidity Non Operating Test	60℃90%RH120Hrs

4	High Temperature Operating Test	70℃*72Hrs

5	Low Temperature Operating Test	-20℃*72Hrs

6	Thermal Shock Test	-20 ℃ (30Min) Q70 ℃ (30Min) *10CYCLES

Inspection standards

Glass defect

NO	Defect item	Criteria	Remark
1	Dimension Unconformity (Major defect)	By Engineering Drawing
2	Cracks (Major defect)	1. Linear cracks panel 【Reject】 2. Nonlinear crack contrast by limited sample
3	Glass extrude the conductive area (minor defect)	a: disregards and no influence assemblage. 1) b≤1/3Pin width(non bonding area) 【Accept】 2) bonding area≤0.5mm 【Accept】	A: Length, b: Width

Pin-side ,conductive area damaged

(minor defect)

(a c: disregards)

b≤1/3of effective length for bonding electrode

【Accept】

a: length, b: Width, c: Thickness

Pin-side,non-conductive area damaged

(minor defect)

1) Damage area don’t touch the ITO (Inclueling contraposition mark, except scribing mark)

【Accept】

2) C<T b≦BM1/3of width

【Accept】

3) c=T

b not touch the seal glue

【Accept】

4) a disregards

a: Length, b: Width c: Thickness

Non-pin-side damage

(minor defect)

c<T

1)b exceeds 1/3Bm

【Reject】

c=T

b not touch the seal glue

【Reject】

c: Thickness b: width of

damage

LCD appearance defect(View area)

NO	Defect item	Criteria		Remark
1	Fiber 、 glass cratch、polarizer scratch/folded (minor defect)	Specification	Allowable	note1:L: Length, W: Width note2: disregard if out of AA
		W≦0.03mm	disregard
		0.03mm<W≦0.05mm; L≦3.0mm	2
		0.05mm<W≦0.1mm; L≦3.0mm	1
		W>0.1mm;L>3.0mm	0
2	Polarizer bubble、concave and convex (minor defect)	φ≦0.2mm	disregard	note1: φ=(L+W)/2,L:Length, W :Width note2:disregard if out of AA
		0.2mm<φ≦0.3mm	2
		0.3mm<φ≦0.5mm	1
		0.5mm<φ	0
3	Black dots、dirty dots、	φ≦0.15mm	disregard	note2:disregard if out of AA

	impurities、eye winker (minor defect)	0.15mm<φ≦0.25mm	2
		0.25mm<φ≦0.3mm	1
		0.3mm<φ	0
4	Polarizer prick (minor defect)	φ≦0.1mm	disregard	note1: φ=(L+W)/2,L=Length, W=Width note2:the distance between two dots>5mm
		0.1mm<φ≦0.25mm	3
		φ>0.25mm	0