Vishay Irfz40 Siliconix Power Mosfet Instruction Manual

Vishay Irfz40 Siliconix Power Mosfet Instruction Manual

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VISHAY IRFZ40 Siliconix Power MOSFET

VISHAY-IRFZ40-Siliconix-Power-MOSFET-product

FEATURESVISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (1)

  • Dynamic dV/dt rating
  • 175 °C operating temperature
  • Fast switching
  • Ease of paralleling
  • Simple drive requirements
  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Note
This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details

DESCRIPTION

Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The TO-220AB package is universially preferred for commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220AB contribute to its wide acceptance throughout the industry.

PRODUCT SUMMARY
VDS (V)60
RDS(on) (Ù)VGS = 10 V0.028
Qg (Max.) (nC)67
Qgs (nC)18
Qgd (nC)25
ConfigurationSingle
ORDERING INFORMATION
PackageTO-220AB
Lead (Pb)-freeIRFZ40PbF
Lead (Pb)-free and halogen-freeIRFZ40PbF-BE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETERSYMBOLLIMITUNIT
Drain-source voltageVDS60V
Gate-source voltageVGS± 20
Continuous drain currentVGS at 10 VTC = 25 °CID50 

A

TC = 100 °C36
Pulsed drain current aIDM200
Linear derating factor 1.0W/°C
Single pulse avalanche energy bEAS100mJ
Maximum power dissipationTC = 25 °CPD150W
Peak diode recovery dV/dt cdV/dt4.5V/ns
Operating junction and storage temperature rangeTJ, Tstg-55 to +175°C
Soldering recommendations (peak temperature) dFor 10 s 300
Mounting torque6-32 or M3 screw 10lbf · in
1.1N · m
THERMAL RESISTANCE RATINGS
PARAMETERSYMBOLTYP.MAX.UNIT
Maximum junction-to-ambientRthJA62 

°C/W

Case-to-sink, flat, greased surfaceRthCS0.50
Maximum junction-to-case (drain)RthJC1.0

 

Notes

  • Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
  • VDD = 25 V, starting TJ = 25 °C, L = 44 μH, Rg = 25 Ω, IAS = 51 A (see fig. 12)
  • ISD ≤ 51 A, dI/dt ≤ 250 A/μs, VDD ≤ VDS, TJ ≤ 175 °C
  • 1.6 mm from case
  • Current limited by the package, (die current = 51 A)

Notes

  • Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
  •  Pulse width ≤ 300 μs; duty cycle ≤ 2 %

SPECIFICATIONS

 (TJ= 25 °C, unless otherwise noted)
PARAMETERSYMBOLTEST CONDITIONSMIN.TYP.MAX.UNIT
Static
Drain-source breakdown voltageVDSVGS = 0 V, ID = 250 μA60V
VDS temperature coefficientÄVDS/TJReference to 25 °C, ID = 1 mA0.060V/°C
Gate-source threshold voltageVGS(th)VDS = VGS, ID = 250 μA2.04.0V
Gate-source leakageIGSSVGS = ± 20 V± 100nA
Zero gate voltage drain currentIDSSVDS = 60 V, VGS = 0 V25μA
VDS = 48 V, VGS = 0 V, TJ = 125 °C250
Drain-source on-state resistanceRDS(on)VGS = 10 VID = 31 Ab0.028Ù
Forward transconductancegfsVDS = 25 V, ID = 31 A15S
Dynamic
Input capacitanceCissVGS = 0 V, VDS = 25 V,

f = 1.0 MHz, see fig. 5

1900 

pF

Output capacitanceCoss920
Reverse transfer capacitanceCrss170
Total gate chargeQg 

VGS = 10 V

 

ID = 51 A, VDS = 48 V,

see fig. 6 and 13b

67 

 

nC

Gate-source chargeQgs18
Gate-drain chargeQgd25
Turn-on delay timetd(on) 

VDD = 30 V, ID = 51 A,

Rg = 9.1 Ù, RD = 0.55 Ù, see fig. 10b

14 

 

ns

Rise timetr110
Turn-off delay timetd(off)45
Fall timetf92
Internal drain inductanceLDBetween lead, 6 mm (0.25″) from package and center of die contact

VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (2)

4.5 

 

nH

Internal source inductanceLS7.5
Drain-Source Body Diode Characteristics
Continuous source-drain diode currentISMOSFET symbol            D showing the integral reverse p – n junction diode  VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (3)50 

A

Pulsed diode forward current aISM200
Body diode voltageVSDTJ = 25 °C, IS = 51 A, VGS = 0 Vb2.5V
Body diode reverse recovery timetrrTJ = 25 °C, IF = 51 A, dI/dt = 100 A/ms120180ns
Body diode reverse recovery chargeQrr0.530.80nC
Forward turn-on timetonIntrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

TYPICAL CHARACTERISTICS

(25 °C, unless otherwise noted)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (4)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (5)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (6)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (7)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (8)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (9)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (10)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (11)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (12)

Peak Diode Recovery dV/dt Test CircuitVISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (13)VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (14)

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91385.

Package Information

TO-220-1VISHAY-IRFZ40-Siliconix-Power-MOSFET-fig- (15)

DIM.MILLIMETERSINCHES
MIN.MAX.MIN.MAX.
A4.244.650.1670.183
b0.691.020.0270.040
b(1)1.141.780.0450.070
c0.360.610.0140.024
D14.3315.850.5640.624
E9.9610.520.3920.414
e2.412.670.0950.105
e(1)4.885.280.1920.208
F1.141.400.0450.055
H(1)6.106.710.2400.264
J(1)2.412.920.0950.115
L13.3614.400.5260.567
L(1)3.334.040.1310.159
Ø P3.533.940.1390.155
Q2.543.000.1000.118
ECN: E21-0621-Rev. D, 04-Nov-2021 DWG: 6031

Note

  • M* = 0.052 inches to 0.064 inches (dimension including protrusion), heatsink hole for HVM

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Revision: 01-Jan-2023
Document Number: 91000
www.vishay.com
S21-1045-Rev. C, 25-Oct-2021
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

References

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