Ebyte E73-2g4m04sid Smd Wireless Module User Manual

Ebyte E73-2g4m04sid Smd Wireless Module User Manual

EBYTE E73-2G4M04SID SMD Wireless Module User Manual
EBYTE E73-2G4M04SID SMD Wireless Module

Overview

Introduction

E73-2G4M04S1D is a SMD bluetooth wireless module based on NORDIC’s nRF51822 RF chip. NRF51822 has high-performance ARM CORTEX-M0 core and Bluetooth 4.2 RF transceiver and protocol stack, and has abundant peripheral resources such as UART, I2C, SPI, ADC, DMA, PWM, etc. The module brings out almost all IO ports, which is convenient for users to conduct multi-faceted development, Please see pin definitions for details. The module has built-in PCB antenna and can connect other antennas through IPEX. The product has obtained FCC, CE, RoHS and other international authoritative certification reports, users do not need to worry about its performance. We use a 32MHzhighprecision low temperature drift active crystal to ensure its industrial properties and stability.
Overview

Because this module is a pure hardware SoC module, users need to program it before they can use it.

Features
  • Communication distance tested is up to 100m;
  • Maximum transmission power of 2.5mW, software multi-level adjustable;
  • Support bluetooth 4.2 and bluetooth 5.0;
  • Built-in 32.768 kHz clock crystal oscillator;
  • Support for the global license-free ISM 2.4GHz band;
  • Rich resources, 256KB FLASH, 16KB RAM;
  • Support 2.0V~3.6V power supply, more than 3.3V power supply can guarantee the best performance;
  • Industrial grade standard design, support -40 ~ 85 °C for a long time;
  • Support onboard PCB antenna and IPEX interface, users can choose according to their needs;
Application
  • Smart home and industrial sensors;
  • Security system and positioning system;
  • Wireless remote control, UAV;
  • Wireless Game Remote Controller;
  • Health care products;
  • Wireless voice, wireless headset;
  • Automotive industry applications.

Specification and parameter

Limit parameter
Main parameterPerformanceRemark
Min.Max.
Power supply(V)03.6Voltage over 3.6V will cause permanent damage to module
Blocking power(dBm)10Chances of burn is slim when modules are used in short distance
Operating temperature(℃)-4085/
Operating parameter
Main parameterPerformanceRemark
Min.Typ.Max.
Operating voltage (V)1.83.33.6≥3.3 V ensures output power
Communication level (V)3.0 For 5V TTL, it may be at risk of burning down
Operating temperature(℃)-4085Industrial design
Operating frequency (MHz)237924302496Support ISM band
Power consumptionTX current (mA) 14 Instant power consumption
RX current (mA) 12  
Sleep current (μA) 1 Software is shut down
Max Tx power (dBm)3.844.3 
Receiving sensitivity (dBm)-95.4-96.0-96.8Air data rate is 1Mbps
Main parameterDescriptionRemark
Distance for reference100mTest condition:clear and open area, antenna gain: 5dBi, antenna height: 2.5m,air data rate: 1Mbps
Crystal frequency16MHz / 32.768KHz 
Support protocalBLE 4.2/5.0 
PackageSMD 
Connector1.27mm 
ICnRF51822-QFAA/QFN48 
FLASH256KB 
RAM16KB 
kernelARM CORTEX-M0 
Size17.5 * 28.7 mm 
AntennaOnboard PCB / IPEXEquivalent impedance is about 50 ohms

Size and pin definition

Size and pin definition
Size and pin definitionSize and pin definition

Pad quantity: 36
Unit: mm

No.Pin itemPin directionApplication
1P0.21Input/OutputMCU GPIO
2P0.22Input/OutputMCU GPIO
3P0.23Input/OutputMCU GPIO
4P0.24Input/OutputMCU GPIO
5P0.25Input/OutputMCU GPIO
6P0.28Input/OutputMCU GPIO
7P0.29Input/OutputMCU GPIO
8P0.30Input/OutputMCU GPIO
9P0.00Input/OutputMCU GPIO
10P0.01Input/OutputMCU GPIO
11VCC Power supply 2.1 ~ 3.6V DC(Note: The voltage higher 3.6V is forbidden)
12GND Ground electrode, connect to power reference ground
13GND Ground electrode, connect to power reference ground
14P0.02 0.9 V Digital power supply decoupling controller
15P0.03Input/OutputMCU GPIO
16P0.04Input/OutputMCU GPIO
17P0.05Input/OutputMCU GPIO
18P0.06Input/OutputMCU GPIO
19P0.07Input/OutputMCU GPIO
20P0.08Input/OutputMCU GPIO
21P0.09Input/OutputMCU GPIO
22P0.10Input/OutputMCU GPIO
23P0.11Input/OutputMCU GPIO
24GNDInput/OutputMCU GPIO
25GNDInput/OutputMCU GPIO
26P0.12Input/OutputMCU GPIO
27P0.13Input/OutputMCU GPIO
28P0.14Input/OutputMCU GPIO
29P0.15Input/OutputMCU GPIO
30P0.16Input/OutputMCU GPIO
 

31

SWDIO/ nRESETInputSerial line debugging and programming debugging / MCU reset, low level enable
32SWDCLKInputSerial Line Debugging / Clock Input Debugging and Programming
33P0.17Input/OutputMCU GPIO
34P0.18Input/OutputMCU GPIO
35P0.19Input/OutputMCU GPIO
36P0.20Input/OutputMCU GPIO
★ For more details, please refer to《nRF51822Datasheet》in NORDIC ★

Basic Operation

Hardware Design
  • It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as small as possible, and the module needs to be reliably grounded.
  • Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse connection is connected, the module may be permanently damaged.
  • Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged.
  • Please check the stability of the power supply, the voltage can not be significantly frequent.
  • When designing the power supply circuit for the module, it is often recommended to reserve more than 30%of the margin, and the whole machine is beneficial for long-term stable operation.
  • The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference.
  • High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to the digital part of the module and routed in the Bottom Layer.
  • Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees.
  • Assume that there are traces with large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If possible, you can do it properly. Isolation and shielding
  • If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage).
  • Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0
  • The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside of the case.
  • The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
Software Programming
  • The core of this module is nRF52832, which is completely equivalent to nRF52832. Users can operate according to the nRF52832 chip manual (see nRF52832 manual for details).
  • Because the officially provided programming tool nRFgo Studio has poor compatibility, it is recommendedtouseJ-LINK-V8 or above for program burning.
  • About the issue that the old model can be programmed, while the new model can’t be programmed, It is because the new model being added with read/write protection during production. It needs to be properly connected to the line and then use the official nRFgo Studio for Recover (Jlink supports the official nRFgo). Studio), as shown below:
    Software Programming

FAQ

Communication range is too short
  • The communication distance will be affected when obstacle exists.
  • Data lose rate will be affected by temperature, humidity and co-channel interference.
  • The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
  • Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
  • The signal will be affected when the antenna is near metal object or put in a metal case.
  • Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
  • When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmitting power is.
  • Due to antenna quality or poor matching between antenna and module.
Module is easy to damage
  • Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
  • Please check the stability of power supply and ensure the voltage not to fluctuate too much.
  • Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatics usceptibility.
  • Please ensure the humidity is within limited range for some parts are sensitive to humidity.
  • Please avoid using modules under too high or too low temperature
High bit error rate
  • There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel to avoid interference.
  • Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
  • If the extension cable or feeder is of poor quality or too long, the bit error rate will be high

Welding operation guidance

Reflow Soldering Temperature
Profile FeatureCurve featureSn-Pb AssemblyPb-Free Assembly
Solder PasteSolder pasteSn63/Pb37Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)Minimum preheating temperature100℃150℃
Preheat temperature max (Tsmax)Maximum preheating temperature150℃200℃
Preheat Time (Tsmin to Tsmax)(ts)Preheating time60-120 sec60-120 sec
Average ramp-up rate(Tsmax to Tp)Average rising rate3℃/second max3℃/second max
Liquidous Temperature (TL)Liquid phase temperature183℃217℃
Time(tL)Maintained Above(TL)Time above liquid us60-90 sec30-90 sec
Peak temperature(Tp)Peak temperature220-235℃230-250℃
Aveage ramp-down rate(Tp to

Tsmax)

 

Average descent rate

 

6℃/second max

 

6℃/second max

Time 25℃ to peak temperatureTime of 25 ° C to peak temperature6 minutes max8 minutes max
Reflow Soldering Curve

Reflow Soldering Curve

Related Model

 

Model

 

Chip

Frequency HzTransmit

power dBm

Test

distance km

Air Data rate 

Packaging

Size mmAntenna Type
E73-2G4M08S1CnRF528402.4G80.1BLE 4.2/5.0SMD13.0 * 18.0PCB/IPX
E73-2G4M04S1AnRF528102.4G40.1BLE 4.2PCB/IPEX17.5 * 28.7PCB/IPX
E73-2G4M04S1DnRF518222.4G40.1BLE 4.2PCB/IPX17.5 * 28.7PCB/IPX
E73-2G4M04S1BnRF528322.4G40.1BLE 4.2/5.0PCB/IPX17.5 * 28.7PCB/IPX

Antenna Type

Antenna recommendation

The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the communication system. Therefore, we recommend some antennas that support our wireless modules and have excel lent performance and reasonable price.

ProductTypeFrequency

Hz

Interfac

e

Gain

dBi

SizeFeederFeatures
TX2400-NP-5010Flexible antenna2.4GIPEX250*10mmBuilt-in flexible FPC soft antenna
TX2400-XP-150Sucker antenna2.4GSMA-J3.515cm150cmHigh Gain
TX2400-JK-20Rubber antenna2.4GSMA-J3200mmFlexible, Omnidirectional
TX2400-JK-11Rubber antenna2.4GSMA-J2.5110mmFlexible, Omnidirectional
TX2400-JZ-3Rubber antenna2.4GSMA-J230mmUltra short straight,Omni directional
Antenna Choice
  • Type: onboard PCB antenna (default)
    Antenna Choice
  • Type: IPEX interface
    Antenna Choice

Revision history

VersionDateDescriptionIssued by
1.002018/8/30Original versionhuaa
1.102018/9/30Model No. splithuaa

About us

Website: www.ebyte.com
Sales: [email protected]
Support: [email protected]
Tel: +86-28-61399028 Ext. 812
Fax: +86-28-64146160
Address: Innovation Center B333~D347, 4# XI-XIN road,High-tech district (west), Chengdu, Sichuan, China

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References

Documents / Resouces

Download manual
Here you can download full pdf version of manual, it may contain additional safety instructions, warranty information, FCC rules, etc.


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