Ebyte E73-2g4m08s1c 2.4ghz Smd Wireless Module User Manual

Ebyte E73-2g4m08s1c 2.4ghz Smd Wireless Module User Manual

EBYTE E73-2G4M08S1C 2.4GHz SMD Wireless Module User Manual
EBYTE E73-2G4M08S1C 2.4GHz SMD Wireless Module

Product overview

Brief Introduction

E73-2G4M08S1C are wireless Bluetooth modules designed by Chengdu Ebyte which feature small size, low power consumption. It adopt the originally imported RFIC nRF52840 of NORDIC, supporting BLE 4.2 and BLE 5.0. The chip has high-performance ARM CORTEX-M4F kernel and other peripheral resources, such as UART, I2C, SPI, ADC, DMA, PWM etc. The module led out most IO Port of nRF52840 for multilateral development.Please see the pin definition for details.

Dimensions

E73-2G4M08S1C is hardware platform without firmware, so users need to conduct a secondary development.The characteristics of the nRF52840 chip can be found in the official Datasheet.

Features
  • Small size: 13x18mm;
  • Support BLE4.2 and BLE 5.0;
  • The measured communication distance is up to 120m;
  • Maximum transmission power of 6mW, software multi-level adjustable;
  • Support the global license-free ISM 2.4GHz band;
  • Built-in high performance low power ARM® and Cortex ® -M4 dual core processor;
  • Rich resources, 1024KB FLASH, 256KB RAM;
  • Support 1.7V~5.5Vpower supply, power supply over 3.3Vcan guarantee the best performance;
  • Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
  • Built-in ceramic antenna, no antenna is required for the built-in antenna.
Application
  • Smart homes and industrial sensors;
  • Security system, positioning system;
  • Wireless remote control, drone;
  • Wireless game remote control;
  • Health care products;
  • Wireless voice, wireless headset;
  • Automotive industry applications.

Specification and parameter

Limit parameter

Main parameter

Performance

Remark

Min

Max

Power supply (V)05.5Voltage over 5.5V will cause permanent damage to module
Blocking power(dBm)10Chances of burn is slim when modules are used in short distance
Operating temperature(℃)-4085
Operating parameter

Main parameter

Performance

Remark

MinTypeMax

Operating voltage(V)

1.73.35.5

≥3.3 V ensures output power

Communication level (V)

3.3

For 5V TTL, it may be at risk of burning down

Operating temperature (℃)

-4085Industrial grade
Operating frequency(GHz)23602500

Support ISM band

Transmitting currentTX only run current (DC/DC, 3 V) PRF = +8 dBm17.05mA
TX only run current (DC/DC, 3 V) PRF = +4 dBm12.68mA
TX only run current (DC/DC, 5 V, REG0 out = 3.3 V)PRF = 0dBm7.25mA
TX only run current (DC/DC, 3 V)P RF = 0 dBm7.63mA
Transmitting currentTX only run current (DC/DC, 3 V) PRF = +8 dBm17.05mA
Receiving currentRX only run current (DC/DC, 3 V) 1 Mbps / 1 Mbps BLE7.71mA
RX only run current (DC/DC, 3 V) 2 Mbps / 2 Mbps BLE8.27mA
Transmitting power789dBm
Receiving sensitivity-103 dBm@BLE 125kbps(long distance mode), -95 dBm@BLE 1M

 

Main parameter

Description

Remark

Reference distance120mClear and open area, antenna gain: 5dBi, antenna height: 2.5m,air data rate: 1Mbps
Crystal Oscillator32MHz
ProtocolBLE 4.2/5.0
PackageSMD
Interface1.27mmStamp hole/Ceramic antenna
ICnRF52840-QIAAC0/ aQFN ™ 73
FLASH1024KB
RAM256KB
CoreARM® Cortex ® -M4
Size13.0 * 18.0 mm
Antennaceramic antenna50 ohm impedance

Size and pin definition

Size and pin definition

Pad quantity: 43
Unit: mm

No.Pin itemCorresponding chip pin itemPin directionApplication
1P1.11P1.11Common I/OSee details about nrf52840 datasheet on Nordic website
2P1.10P1.10Common I/OLow frequency I/O, standard drive
3P0.03P0.03/AIN1Common I/OAnalog input 1, low frequency I/O, standard drive
4AI4P0.28/AIN4Common I/OAnalog input 4
5GNDSingle ground line , connect to the power reference ground
6P1.13P1.13Common I/OLow frequency I/O, standard drive
 7AI0P0.02/AIN0Common I/OAnalog input 0, low frequency I/O, standard drive
8AI5P0.29/AIN5Common I/OAnalog input 5, low frequency I/O, standard drive
9AI7P0.31/AIN7Common I/OAnalog input 7, low frequency I/O, standard drive
drive
10AI6P0.30/AIN6Common I/OAnalog input 6, low frequency I/O, standard drive
11XL1P0.00/XL1Common I/OConnect to 32.768 kHz crystal
12P0.26P0.26Common I/OSee details about nrf52840 datasheet on Nordic website
13XL2P0.01/XL2Common I/OConnect to 32.768 kHz crystal
14P0.06P0.06Common I/OSee details about nrf52840 datasheet on Nordic website
15AI3P0.05/AIN3Common I/OAnalog input 3
16P0.08P0.08Common I/OSee details about nrf52840 datasheet on Nordic website
17P1.09P1.09Common I/OSee details about nrf52840 datasheet on Nordic website
18AI2P0.04/AIN2Common I/OAnalog input 2
19VDDPower supply
20P12P0.12Common I/OSee details about nrf52840 datasheet on Nordic website
21GNDground line , connect to the power reference ground
22P0.07P0.07Common I/OSee details about nrf52840 datasheet on Nordic website
23VDHVDDHHigh-voltage power supply
24GNDground line , connect to the power reference ground
25DCHDCCHDC/DC Converter output
26RSTP0.18/RESETCommon I/OQSPI/CSN/external reset
27VBSVBUSUSB power supply , 5V input , used to USB3.3V voltage regulator
28P15P0.15Common I/OSee details about nrf52840 datasheet on Nordic website
29D-USB D-
30P17P0.17Common I/OSee details about nrf52840 datasheet on Nordic website
31D+USB D+
32P0.20P0.20Common I/OSee details about nrf52840 datasheet on Nordic website
33P0.13P0.13Common I/OSee details about nrf52840 datasheet on Nordic website
34P0.22P0.22Common I/OQSPI
35P0.24P0.24Common I/O
36P1.00P1.00Common I/OSee details about nrf52840 datasheet on Nordic website
37SWDSWDIOSerial debug programming port data
38P1.02P1.02Common I/OSee details about nrf52840 datasheet on Nordic website
39SWCSWDCLKSerial debug programming port clock
40P1.04P1.04Common I/OLow frequency I/O, standard drive
41NF1P0.09/NFC1Common I/ONFC input
42P1.06P1.06Common I/OLow frequency I/O, standard drive
43NF2P0.10/NFC2Common I/ONFC input

Development and Application

No.

Item

Notes

1Burn Firmware
  • The module is embedded with ARM MCU. For program downloading, please use the J-LINK downloader. Any other serial port or JTAG、ISP、ICP are unavailable to download.
  • The burn firmware needs to be completed in two parts. Since the protocol stack provided by NORDIC is not loaded in the program, in the second development, you need to use the official burning tool nRFgo studio to burn the protocol stack, and then use nRFgo studio to burn. The hex of the application code; you can also use the official burning tool nRFgo studio to burn the protocol stack, and then download it with IAR or KEIL. Website of tool download:
    http://www.nordicsemi.com/eng/Products/Bluetooth-low-energy/nRF52832/(language)/eng-GB
    Inductions
2Testing BoardTesting board is not available.

Basic operation

 Hardware design

Hardware design

  • It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded.
  • Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module.
  • Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;
  • Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
  • When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation;
  • The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference;
  • Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in the Bottom Layer;
  • Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;
  • It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
  • Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding can be done;
  • If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);
  • Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
  • The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside;
  • The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.

 

FAQ

Communication range is too short
  • The communication distance will be affected when obstacle exists;
  • Data lose rate will be affected by temperature, humidity and co-channel interference;
  • The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
  • Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
  • The signal will be affected when the antenna is near metal object or put in a metal case;
  • Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance);
  • The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the lower the transmitting power;
  • Due to antenna quality or poor matching between antenna and module.
Module is easy to damage
  • Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
  • Please check the stability of power supply and ensure the voltage not to fluctuate too much.
  • Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.
  • Please ensure the humidity is within limited range for some parts are sensitive to humidity.
  • Please avoid using modules under too high or too low temperature.
BER(Bit Error Rate) is high
  • Here are co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;
  • Poor power supply may cause messy code. Make sure that the power supply is reliable;
  • The extension line and feeder quality are poor or too long, so the bit error rate is high.

Production guidance

Reflow soldering temperature

Profile Feature

曲线特征Sn-Pb Assembly

Pb-Free Assembly

Solder PasteSolder pasteSn63/Pb37Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)Min preheating temp.100℃150℃
Preheat temperature max (Tsmax)Max preheating temp.150℃200℃
Preheat Time (Tsmin to Tsmax)(ts)Preheating time60-120 sec60-120 sec
Average ramp-up rate(Tsmax to Tp)Average ramp-up rate3℃/second max3℃/second max
Liquidous Temperature (TL)Liquid phase temp183℃217℃
Time(tL)Maintained Above(TL)Time below liquid phase line60-90 sec30-90 sec
Peak temperature(Tp)Peak temp220-235℃230-250℃
Aveage ramp-down rate(Tp to Tsmax)Average ramp-down rate6℃/second max6℃/second max
Time 25℃ to peak temperatureTime to peak temperature for 25℃6 minutes max8 minutes max
Reflow soldering curve

Reflow soldering curve

E73 series

ModelICFrequency HzTx power dBmDistance kmProtocolPackageSize mmAntenna
E73-2G4M08S1C 

nRF52840

 

2.4G

 

8

 

0.1

 

BLE 4.2/5.0

 

SMD

13.0 * 18.0Ceramic antenna/Sta mp hole
E73-2G4M04S1AnRF528102.4G40.1BLE 4.2/5.0SMD17.5 * 28.7PCB/IPX
E73-2G4M04S1DnRF518222.4G40.1BLE 4.2SMD17.5 * 28.7PCB/IPX
E73-2G4M04S1BnRF528322.4G40.1BLE 4.2/5.0SMD17.5 * 28.7PCB/IPX

Antenna recommendation

Recommendation

The antenna is an important role in the communication process. A good antenna can largely improve the communication system.

Model No.

TypeConnectorGain dBiHeightCable

Feature

TX2400-NP-5010Flexible AntennaIPEX250*10mmFPC soft antenna
TX2400-XP-150Sucker antennaSMA-J3.515cm150cmHigh Gain
TX2400-JK-20Rubber antennaSMA-J3200mmFlexible&omnidirectional
TX2400-JK-11Rubber antennaSMA-J2.5110mmFlexible&omnidirectional
TX2400-JZ-3Rubber antennaSMA-J230mmShort straight &omnidirectional

Revision history

Version

DateDescriptionIssued by
1.002018/8/30Initial version

huaa

1.10

2018/9/28Version splithuaa
1.402018/11/6new version update

Huaa

1.5

2019/2/19

Content modificationRay
1.72019/8/20Contect updated

lyl

1.8

2019/11/06Content modificationRen
1.92020/03/30

Ren

About us

Technical support: [email protected]

Documents and RF Setting download link::www.ebyte.com

Thank you for using Ebyte products! Please contact us with any questions or suggestions: [email protected]

Official hotline:028-61399028 ext. 821
Web: www.ebyte.com
Address:
Innovation Center D347, 4# XI-XIN Road,Chengdu, Sichuan, China

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Documents / Resouces

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