Dell Emc Poweredge R740xd Rack Server Owner's Manual

Dell EMC PowerEdge R740xd
Technical Specifications

Regulatory Model: E38S Series
Regulatory Type: E38S001
July 2020
Rev. A05

Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

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Technical specifications

The technical and environmental specifications of your system are outlined in this section.

System dimensions

This section describes the physical dimensions of the system.

Figure 1. System dimensions of PowerEdge R740xd system

Table 1. Dimensions

Chassis weight

Table 2. Chassis weight

Processor specifications

The PowerEdge R740xd system supports up to two Intel xeon Processor Scalable Family processors, up to 28 cores per processor.
NOTE: Processor sockets are not hot pluggable

Supported operating systems

The PowerEdge R740xd supports the following operating systems: Canonical Ubuntu LTS
Citrix XenServer
Microsoft Windows Server with Hyper-V Red Hat Enterprise Linux
SUSE Linux Enterprise Server VMware ESXi

NOTE: For more information, go to video/support

PSU specifications

The PowerEdge R740xd system supports up to two AC or DC power supply units (PSUs).
Table 3. PSU specifications

Table 3. PSU specifications (continued)

NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 240 V.
NOTE: PSUs rated for 1100 W Mixed Mode HVDC or 1100 W AC and higher require high-line voltage (200–240 V AC) to supply their rated capacity.

System battery specifications

The PowerEdge R740xd system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The PowerEdge R740xd system supports up to eight PCI express (PCIe) generation 3 expansion cards that can be installed on the system board using expansion card risers. The following table provides detailed information about the expansion card riser specifications:

Table 4. Expansion card riser configurations

Table 5. Expansion card riser specifications

NOTE:

• Riser slots are not hot pluggable.
• Internal cable connectors are not hot pluggable.

Memory specifications

Table 6. Memory specifications

Table 6. Memory specifications (continued)

NOTE: 8 GB RDIMMs and NVDIMM-N must not be mixed.
NOTE: 64 GB LRDIMMs, 128 GB LRDIMMs must not be mixed.
NOTE: Minimum of two CPUs are required for any configurations that support NVDIMM-N.
NOTE: DCPMM can be mixed with RDIMMs and LRDIMMs.
NOTE: Mixing of DDR4 DIMM Types (RDIMM, LRDIMM), within channel, integrated memory controller, socket, or across sockets is not supported.
NOTE: x4 and X8 DDR4 DIMM can be mixed within channel.
NOTE: Mix of Intel Data center persistent memory module operating modes (App Direct, Memory Mode) is not supported within socket or across sockets.
NOTE: Memory DIMM slots are not hot pluggable.

Storage controller specifications

The PowerEdge R740xd system supports:

• Internal storage controller cards: PowerEdge RAID Controller (PERC) H330, PERC H730P, PERC H740P, HBA330, S140, and Boot Optimized Server Storage (BOSS-S1).
  The BOSS card is a simple RAID solution card designed specifically for booting a server’s operating system. The card supports up to two 6 Gbps M.2 SATA drives. The BOSS adapter card has a x8 connector using PCIe gen 2.0 x2 lanes, available only in the low-profile and half-height form factor.
• External storage controller cards: PERC H840 and 12Gbps SAS HBA.
  NOTE: Mini-PERC socket is not hot pluggable.

Drive specifications

Drives

The PowerEdge R740XD system supports SAS, SATA, Nearline SAS hard drives/SSDs, or NVMe drives.
Table 7. Supported drive options for the PowerEdge R740XD system

Table 7. Supported drive options for the PowerEdge R740XD system (continued)

NOTE: Universal slots are slots that support SAS, SATA hard drives/SSDs, or NVMe drives in the same slot.

Ports and connectors specifications

USB ports

The PowerEdge R740xd system supports:

• Two USB 0-compliant ports on the front of the system
• One internal USB 0-compliant port
• One micro USB 0-compliant port in the front of the system for iDRAC Direct
• Two USB 0-compliant ports on the back of the system

NIC ports

The PowerEdge R740xd system supports up to four Network Interface Controller (NIC) ports that are integrated on the network daughter card (NDC), and are available in the following configurations:

• Four RJ-45 ports that support 10, 100 and 1000 Mbps
• Four RJ-45 ports that support 100 M, 1 G and 10 Gbps
• Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 G
• Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps
• Four SFP+ ports that support up to 10 Gbps
• Two SFP28 ports that support up to 25 Gbps

NOTE: You can install up to eight PCIe add-on NIC cards.
NOTE: NDC slot is not hot pluggable.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R740xd system supports two 15-pin VGA ports on the front and back panels.

NOTE: The VGA ports are not hot pluggable.

Serial connector

The PowerEdge R740xd system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.
NOTE: The Serial port is not hot pluggable.

Internal Dual SD Module or vFlash card

The PowerEdge R740xd system supports Internal Dual SD module (IDSDM) and vFlash card. In 14th generation of PowerEdge servers, IDSDM and vFlash card are combined into a single card module, and are available in these configurations:

• vFlash or
• IDSDM or
• vFlash and IDSDM
  The IDSDM/vFlash card sits in the back of the system, in a Dell-proprietary slot. IDSDM/vFlash card supports three micro SD cards (two cards for IDSDM and one card for vFlash). Micro SD cards capacity for IDSDM are 16/32/64 GB while for vFlash the microSD card capacity is 16 GB.
  NOTE: IDSDM and vFlash slot is not hot pluggable.

Video specifications

The PowerEdge R740xd system supports integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.
Table 8. Supported video resolution options

NOTE: 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.

Environmental specifications

NOTE: For additional information about environmental certifications, please refer to the Product Environmental Datasheet
located with the Manuals & Documents on www.dell.com/poweredgemanuals.
Table 9. Temperature specifications

Table 10. Relative humidity specifications

Table 11. M aximum vibration specifications

Table 12. Maximum shock specifications

Table 13. Maximum altitude specifications

Table 14. Operating temperature de-rating specifications

Standard operating temperature

Table 15. Standard operating temperature specifications

Expanded operating temperature

Table 16. Expanded operating ternperature specifications

Expanded operating temperature	Specifications
Continuous operation	5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to US°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 55°C to 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
1% of annual operating hours	—5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to US°C), the system can operate down to —5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: When operating in the expanded temperature range, system performance may be impacted.
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.

Expanded operating temperature restrictions

• 128 GB LRDIMM is not supported for FAC.
• Do not perform a cold startup below 5°C.
• The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
• 150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not supported.
• Redundant power supply unit is required.
• Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
• PCIe SSD is not supported.
• NVDIMM-Ns are not supported.
• DCPMMs are not supported.
• Mid drive tray is not supported.
• Rear storage devices or drives are not supported.
• GPU is not supported.
• Tape backup unit is not supported.

Thermal restrictions

Following table lists the configuration required for efficient cooling.
Table 17. Thermal restrictions configuration

Ambient temperature limitations

The following table lists configurations that require ambient temperature less than 35°C.
NOTE: The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess CPU throttling, which may impact system performance.
Table 18. Configuration based ambient temperature restrictions

Table 18. Configuration based ambient temperature restrictions (continued)

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 19. Particulate contamination specifications

Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV15
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments.
Corrosive dust	● Air must be free of corrosive dust. ● Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments.

Table 20. Gaseous contamination specifications

NOTE: Maximum corrosive contaminant levels measured at < 50% relative humidity.

References

• Server Operating Systems | Dell US
• Support | Dell US
• Support | Dell US