MB1-130-01-F-S-01-SL Mini Edge Card Socket with Guides
Product Information
Product: F-221 SUPPLEMENT
Series: MB1
Type: Mini Edge Card Socket with Guides
Plating Option: S (Gold flash on contact, Matte Tin on tail)
Number of Pins: 01
Card Slot: SL (Specify CARD SLOT from chart)
Mates with PCB Thicknesses: (0.80 mm) .031 and (1.60 mm) .062
Pitch: (1.00 mm) .03937
SMT Lead Coplanarity: (0.10 mm) .004 max (20-30), (0.15 mm) .006
max (40-50)*
Choice of two card thicknesses: (5.44 mm) .214
Other Options: Guides (A)
Recognitions: For complete scope of recognitions see www.samtec.com/quality
File No.: E111594
Also Available: (3.81) .150
Product Usage Instructions
- Ensure that the PCB has a thickness of either (0.80 mm) .031 or
(1.60 mm) .062. - If required, specify the CARD SLOT from the provided
chart. - For proper mating, align the Mini Edge Card Socket with the PCB
and insert the card into the slot. - Verify that the number of pins on the Mini Edge Card Socket
matches the requirements of your application (in this case,
01). - If using the Guides option, ensure they are properly installed
for alignment purposes. - Check the SMT Lead Coplanarity, which should be within the
specified range (0.10 mm) .004 max (20-30) or (0.15 mm) .006 max
(40-50)*. - Consider using Gold plated pads on the mating board for optimal
performance (recommended by Samtec). - Refer to the product’s Recognitions on www.samtec.com/quality for further
information. - For any non-standard or non-returnable sizes, styles, or
options, contact Samtec directly.
F-221 SUPPLEMENT
MB1130 01 F S 01 SL N
MB1130 01 F S 01 SL
(1.00 mm) .0394″
MB1 SERIES
MINI EDGE CARD SOCKET WITH GUIDES
SPECIFICATIONS
For complete specifications and recommended PCB layouts see www.samtec.com?MB1
Insulator Material: Black LCP Contact Material: BeCu Plating: Sn or Au over 50 µ” (1.27 µm) Ni Current Rating: 2.2 A per pin (6 pins powered) Operating Temp Range: -55 °C to +125 °C Insertion Depth: (5.26 mm) .207″ to (6.10 mm) .240″ RoHS Compliant: Yes
Mates with: (0.80 mm) .031″ PCB, (1.60 mm) .062″ PCB
PROCESSING
(1.00 mm) .03937″ pitch
LeadFree Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004″ max (20-30)
(0.15 mm) .006″ max (40-50)* *(.004″ stencil solution may be available; contact
MB1
1
NO. OF PINS
01
PLATING OPTION
S
Choice of two card thicknesses
(5.44 mm) .214″
CARD SLOT
SL
OTHER OPTION
RECOGNITIONS
For complete scope of recognitions see www.samtec.com/quality
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required) · Other platings
(3.81) .150
20, 30, 40, 50
(No. of Positions + 2) x (1.00) .03937 + (4.06) .160
F
= Gold flash on contact, Matte Tin on tail
L
= 10 µ” (0.25 µm) Gold on contact, Matte Tin on tail
Specify CARD SLOT from chart
N
= No Card
Guides
CARD SLOT 01
02
A
MATES WITH BOARD THICKNESS
(0.97) .038
(0.80) .031
(1.83) .072
(1.60) .062
Note: Some sizes, styles and options are non-standard, non-returnable.
(25.5) 1.004
(7.24) .285
01
(1.00) .03937
50
(0.36) .014
(1.52) .060
(No. of Positions + 2) x (1.00) .03937
(1.27) .050 DIA
(0.15) (5.44) .006 .214
(0.69) .027
Important Note: Samtec recommends that pads on the mating board be Gold plated.
N OPTION
(1.27) .050
A
(7.24) .285
(1.27) .050
(2.36) .093
WWW.SAMTEC.COM
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.
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