Bde-blem401p Bluetooth Low Energy Module User Manual

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BDE-BLEM401P

 

Bluetooth Low Energy Module (BT4.2)

BDE-BLEM401P Bluetooth Low Energy Module A1        BDE-BLEM401P Bluetooth Low Energy Module A2
BDE-BLEM401P             BDE-BLEM401P-U

Key Features
  • Bluetooth Dual Mode 4.2 compliant
  • Low-power 2.4GHz Transceiver
  • ARM968E Core Microprocessor integrated
  • 160 KB programmable Flash for Program and 20 KB RAM for Data
  • Program code read protection
  • Operation voltage from 0.9 V to 3.6 V
  • Clock
    Bullet point16 MHz crystal reference clock
    Bullet point64 MHz digital PLL clock
    Bullet point32 kHz ring oscillator
    Bullet pointExternal 32 kHz crystal oscillator
    Bullet pointMCU can run with any clock source with internal frequency divider
  • Interface and peripheral units
    Bullet pointJTAG, SPI interface
    Bullet pointUART
    Bullet pointMulti-channels PWM output
    Bullet pointOn-chip 10 bit general ADC
    Bullet point13 GPIO with multiplexed interface functions
    Bullet pointTrue random number generator
  • RF Performance
    Bullet pointTX Power: up to 4dBm
    Bullet pointRX Sensitivity: up to -96dBm
  • Communication Range: 30 meters (LOS)
  • Antenna:
    Bullet pointIntegrated PCB antenna -­ 401P
    Bullet pointIPEX/U.FL connector for external antenna ­- 401P-U
  • Size: 16.55mm x 10.8mm x 1.5mm (Without Shielding)
    16.55mm x 10.88 mm x 2.3mm (With Shielding)
  • Power Consumption:
    Bullet pointShutdown: 1uA (Wake up on External Events)
    Bullet pointStandby: 8.5uA (RTC Running and RAM/CPU Retention)
    Bullet pointRX Current: 5.1mA
    Bullet pointTX Current @ -1dBm: 4.8mA
  • BQB (DID: D049515), FCC ID: 2ABRUBDLEM401P, CE, RoHS compliant
Descriptions

BDE-BLEM401P is a Bluetooth 4.2 dual mode compliant module targeted at low power sensors and PC/Phone accessories.

BDE-BLEM401P highly integrates a high-performance RF transceiver, baseband, ARM9E core, programmable protocol and profile to support BLE application. The module also offers flexible hardware interfaces for the sensor application.

It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.

Block Diagram

Fig. 1: The Block Diagram of BDE-BLEM401PFig. 1: The Block Diagram of BDE-BLEM401P

Applications
  • Home and Building Automation
  • Industrial
  • Retail
  • Health and Medical
  • Sports and Fitness
  • HID
Electrical Characteristics
  • Recommended operating conditions

Rating

MinTypMaxUnit
Operating Temperature-4085

VDDS

1.63.33.6

V

Pin Out

BDE-BLEM401P Bluetooth Low Energy Module A4Fig. 2: The pinout of BDE-BLEM401P (TOP VIEW)

Table 1: Pin definitions of BDE- BLEM203P

Pin NumberPin NameDefinitions
1GNDPower Ground
2VDDPower Supply
3P04GPIO, SPI_SCK, SPI_MOSI (Program mode), JTAG_TDI (JTAG mode) 
4P05GPIO, SPI_MOSI, SPI_MISO (Program mode), JTAG_TDO (JTAG mode)
5NCNC
6P32GPIO, ADC CH2
7NCNC
8NCNC
9NCNC
10NCNC
11GNDPower Ground
12NCNC
13NCNC
14NCNC
15P17GPIO, UART2_RX
16P14GPIO, PWM 
17P34GPIO, ADC CH4
18NCNC
19VDDPower Supply
20GNDPower Ground
21P12GPIO, PWM 
22P10GPIO, PWM (20mA)
23P16GPIO, UART2_TX
24P00GPIO, UART_TX 
25P01GPIO, UART_RX
26P07GPIO, SPI_NSS, SPI_CS (Program mode), JTAG_TMS (JTAG mode) 
27P06GPIO, SPI_MISO, SPI_SCK (Program mode), JTAG_TCK (JTAG mode)
28RSTReset, active low
29GNDPower Ground 
Overall Dimensions

Fig. 1 shows the overall dimensions of BDE-BLEM401P. The module measures 16.55mm long by 10.88mm wide by 2.3mm high with the shield.

BDE-BLEM401P Bluetooth Low Energy Module A5aBDE-BLEM401P Bluetooth Low Energy Module A5bBDE-BLEM401P Bluetooth Low Energy Module A5c

Top View

Bottom View

Side View

Fig. 3: Overall Dimensions of BDE-BLEM401P

Module Location for Reference

In order to get a fine performance when integrate the module to your product, it is advised to use the recommended module location to the respective PCB.

  • Location in X-Y plane

BDE-BLEM401P Bluetooth Low Energy Module A6a               BDE-BLEM401P Bluetooth Low Energy Module A6b
Fig. 4: Recommended location in X-Y plane

  1. Antenna area.
    This area of the mother board should be cut off or copper free.

BDE-BLEM401P Bluetooth Low Energy Module A7a               BDE-BLEM401P Bluetooth Low Energy Module A7b
Fig. 5: Not recommended location in X-Y plane

  • Location in Z plane

BDE-BLEM401P Bluetooth Low Energy Module A8Fig. 6: Recommended location in Z plane

  1. Metal
  2. Cut off or copper free
  3. Mother Board

BDE-BLEM401P Bluetooth Low Energy Module A9Fig. 7: Not recommended location in Z plane

  1. Metal
Typical Solder Reflow Profile

BDE-BLEM401P Bluetooth Low Energy Module A10Fig. 8: Typical Solder Reflow Profile

Package Information

BDE-BLEM401P Bluetooth Low Energy Module A11Fig. 9: Package

FCC statements

This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) This device must accept any interference received, including interference that may cause undesired operation.

NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment.

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and receiver.
– Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
– Consult the dealer or an experienced radio/TV technician for help.

The SAR limit of USA (FCC) is 1.6 W/kg averaged over one gram of tissue. Device types Panasonic ELUGA Ray 600 (FCC ID: 2APTIS60ER6) has also been tested against this SAR limit.The highest SAR value reported under this standard during product certification for use when properly worn on the body is 0.681 W/kg and for head is 0.898 W/kg. Simultaneous RF exposure is 1.233W/Kg. This device was tested for typical body-worn operations with the back of the handset kept 10mm from the body. To maintain compliance with FCC RF exposure requirements, use accessories that maintain a 10mm separation distance between the user’s body and the back of the handset. The use of belt clips, holsters and similar accessories should not contain metallic components in its assembly. The use of accessories that do not satisfy these requirements may not comply with FCC RF exposure requirements, and should be avoided.

Contacts

Guangzhou BDE Technology Inc.

Address: Originality Building B2-403, 162 Science Ave, Huangpu District, Guangzhou, 510663, China 494 E Thornhill Ln, Palatine, IL 60074, USA
Tel: +86-020-28065335          Fax: +86-020-28065338

Website: www.bdecomm.com       Email: [email protected]

Guangzhou BDE Technology Inc.

References

Documents / Resouces

Download manual
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