Waterpik 20028186 Bluetooth Low Energy Radio Module User Manual

Waterpik 20028186 Bluetooth Low Energy Radio Module User Manual

Waterpik 20028186 Bluetooth Low Energy Radio Module

WATERPIK BLUETOOTH LOW ENERGY MODULE USER MANUAL

The 20028186 module has been evaluated in stand-alone conditions. For different operational conditions from a stand-alone modular transmitter in a host (multiple, simultaneously transmitting modules, or other transmitters in a host), may require additional testing. If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuitry), then the grantee shall provide a notice stating that the final host product sill requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end product with an embedded module may also need to pass the FCC Part 15 unintentional emission testing requirement and be properly authorized per FCC Part 15.

This module is not intended to transmit simultaneously with any other antenna or transmitter. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The final host/module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The User’s Manual or Instruction Manual for an intentional or unintentional radiator shall caution the user that changes for modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the modules(s) installed and operational. For example, if a host was previously authorized as an unintentional radiator under the declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements.

VERSION HISTORY

VersionComment
0.0Initial Draft
0.1Updated regulatory certifications
1.0Removed Schematics and Bill of Material and updated Figure reference. Initial

Release

1.1Added ISED sections
1.2Adjustments to exposure limits
1.3Correct numbering

DESCRIPTION

Features:
  • System-on-a-Chip Core:
    • ARC EM4 32-bit MCU running at 24MHz
    •  Floating-point unit for supporting sensor processing
    •  128KB OTP (for parameters, profiles, and applications)
    •  48KB instructions RAM
    •  28KB Data RAM
    •  I2C and SPI master interfaces
    • Up to 12 GPIOs
  • Optimized Bluetooth 5.0 Low Energy 2.4GHz RF Transceiver
    • Bluetooth stack in ROM
    •  SPI and UART HCI/ACI Transport Layers
    • Up to 8 simultaneous connections supported
    •  Extended PDU length and enhanced security
  • Firmware Over-the-Air (FOTA) updating
  • Secure
    •  True Random Number Generator
    •  AES-128 Hardware Encryption Engine
    • Key Generation (ECC-P256)
  •  Onboard step-down DC to DC converter
  •  High-performance RF:
    •  -34dBm to +6.1dBm output transmit power range
    • ISM Band 2.405GHz – 2.48GHz Operation
  •  Small size: 0.450” x 0.645” x 0.077”, surface Mountable
  •  Integrated crystals (48MHz and 32.768KHz), Internal Voltage Regulator, Matching Circuitry and PCB Antenna
  • Radio Regulation Certifications for the United States (FCC), Canada (IC), and Europe (ETSI)
  •  Up to 400 ft. Range

Operational

  •  Operating Voltage: 1.9V – 3.6V (Module Configured for Buck Operation)
  • Temperature Range: -40°C – 85°C
  • Low-Current Consumption:
    •  RX Mode: 3.0mA (typical)
    • TX Mode: 5.2mA (typical) peak transmitter current at 0.4dBm
    •  Sleep: 1.0µA connected
  •  Bluetooth low energy Receiver Sensitivity: -94dBm (1Mbps operation and 37-byte payload)

PINOUT AND TERMINAL DESCRIPTION

The pin diagram for the 20028186 module is as follows:

The available pins are:

MODULE PINPIN NAMEDESCRIPTIONPRIMARY FUNCTIONALTERNATIVE FUNCTION
1GNDGround pin for the moduleGROUND 

 

 

 

 

 

See Figure 3

2VBAT2Power input (VCC), 1.9V to 3.6VVCC
3VIOVoltage reference pin for IO. Connect to

VBAT2

VCC2
4ENChip enable. Active high.ENABLE
5GPIO5General Purpose Input/Output pinGPIO
6GPIO6General Purpose Input/Output pinGPIO
7GPIO0General Purpose Input/Output pinGPIO
8GPIO1General Purpose Input/Output pinGPIO
9GPIO2General Purpose Input/Output pinGPIO
10GPIO3General Purpose Input/Output pinGPIO
11GPIO7General Purpose Input/Output pinGPIO
12GPIO4General Purpose Input/Output pinGPIO
13GPIO8General Purpose Input/Output pinGPIOTCK (JTAG)
14GPIO9General Purpose Input/Output pinGPIOTDO (JTAG)
15GPIO10General Purpose Input/Output pinGPIOTDI (JTAG)
16GPIO11General Purpose Input/Output pinGPIOTMS (JTAG)

The GPIO pins can be further mapped for the following functions:

GPIO Pins can be configured as digital input, push-pull output, or selectable pull-down/pull-up resistors. There are 3.3V standard protections against VSS and VIO. Peripherals for the module include I2C master, SPI master and slave, UART, GPIO, and timers. Flow control is included for SPI slave mode maximum transfer efficiency. Both the I2C master and SPI master have 16-byte buffers. Both UART slave and SPI slave have FIFOs implemented for 64-byte FIFOs for RX and TX and 1 to 4 byte register reads from RX FIFO or writes to TX FIFO. FIFO status registers and interrupts are available for many different conditions.

ELECTRICAL CHARACTERISTICS

The information provided (below) is based on information provided from the EM Microelectronic EM9304 Datasheet and has not been independently verified for accuracy.

PARAMETERSCONDITIONMINIMUMTYPICALMAXIMUMUNITS
Supply Voltage for VBAT2, VIODC to DC step-down1.913.33.6V
Schmidt Trigger Hysteresis0.05 X VIOV
Input High Voltage (VIH)VIO  ≥ 1.9V0.7 X VIOV
VIO  < 1.9V0.85 X VIO
Input Low Voltage (VIL)VIO  ≥ 1.9V0.3 X VIOV
VIO  < 1.9V0.15 X VIOV
Output High Voltage HighIOUT = -3mA, VIO = 1.9V1.5V
IOUT = -8mA, VIO = 1.9V0.84V
Output Low Voltage LowIOUT = 3mA, VIO = 1.9V0.4V
IOUT = 0.8mA, VIO = 1.9V0.21V
Pull Up resistor GPIO581018KΩ
Pull Up resistor GPIO70100130KΩ
Ambient Operating

Temperature

-40+85°C

2.3V is required for OTP programming.

PARAMETERSMINIMUMTYPICALMAXIMUMUNITS
RX Mode3.0mA
TX Mode, TX Power Level 02.2mA
TX Mode, TX Power Level 12.4mA
TX Mode, TX Power Level 22.8mA
TX Mode, TX Power Level 32.9mA
TX Mode, TX Power Level 43.0mA
TX Mode, TX Power Level 53.1mA
TX Mode, TX Power Level 63.2mA
TX Mode, TX Power Level 73.3mA
TX Mode, TX Power Level 83.4mA
TX Mode, TX Power Level 93.6mA
TX Mode, TX Power Level 103.8mA
TX Mode, TX Power Level 114.1mA
TX Mode, TX Power Level 124.3mA
TX Mode, TX Power Level 134.6mA
TX Mode, TX Power Level 145.2mA
TX Mode, TX Power Level 155.6mA
TX Mode, TX Power Level 167.5mA
TX Mode, TX Power Level 179.9mA
Active RC10/2mA
Active XTAL10.4mA
ECC ROM Execution in a loop0.7mA
Coremark test from IRAM11.2mA
Coremark test from OTP1.6mA
Sleep Mode, LF RC1.0mA
Sleep Mode, LF XTAL0.95mA
Deep Sleep Mode0.65mA
Chip Disabled5mA
Battery Peak Currents210.3mA

CPU halted.

Typical value using pi-filter. Valid for 0dBm TX power level and below

PARAMETERSCONDITIONMINIMUMTYPICALMAXIMUMUNITS
Step-Down, DCDC offVBAT = 3.0V, Ramp = 0.3V/µs, LF RC3.6ms
Any32KHz crystal or external signal

used

1.2s
MODE 1MODE 2CONDITIONMINIMUMTYPICALMAXIMUMUNITS
SleepActive XTALHCI/ACI Command RDY

(Depends on Crystal Q)

1.1ms
PARAMETERSCONDITIONMINIMUMTYPICALMAXIMUMUNITS
Output Low VoltageIOUT = 3mA, VIO = 1.9V0.1V
IOUT = 2mA, VIO = 1.9V0.21V
PARAMETERSCONDITIONMINIMUMTYPICALMAXIMUMUNITS
Output Delay, Falling Edge (VBAT = 1.05V to 3.6V)Output Load = 25pF500ns
Output Load = 150pF520ns
Output Load = 400pF540ns

PARAMETERSSymbolMINIMUMTYPICALMAXIMUMUNITS
Clock Frequency Slavet_frq_s16MHz
Clock Frequency Mastert_frq_m6MHz
Data Setup Time (input)t_dsi10ns
Data Hold Time (input)t_dhi10ns
Data Setup Time (output)t_dso(1/t_frq)-46nsns
Data Hold Timet_dhd13ns
CSN Setup Timet_cssu100ns
CSN Hold Timet_cshd100ns
Data Setup Time Master

(input)

t_dsim35ns
Data Hold Time Master

(input)

T_dhim10ns
PARAMETERSSymbolMINIMUMTYPICALMAXIMUMUNITS
Clock Frequency Slavet_frq_s8MHz
Clock Frequency Mastert_frq_m3MHz
Clock Pulse Width Lowt_clkl0.4/t_frqµs
Clock Pulse Width Hight_clkh0.4/t_frqµs
Data Setup Time (input)t_dsi10µs
Data Hold Time (input)t_dhi10µs
Data Setup Time (output)t_dso(1/t_frq)-46nsµs
Data Hold Timet_dhd13µs
CSN Setup Timet_cssu100µs
CSN Hold Timet_cshd100µs
Data Setup Time Master

(input)

t_dsim60µs
Data Hold Time Master

(input)

T_dhim10µs
PARAMETERSCONDITIONMINIMUMTYPICALMAXIMUMUNITS
RF Input FrequencyCompatible to IEEE 802.15.4,

2003

2.4052.480GHz
RF Sensitivity1Mbps, 37 byte payload-94dBm
1Mbps, 255 byte payload-93dBm
Maximum Input Power1Mbps, 255 byte payload0dBm
PARAMETERCOMMENTSYMBOLMINIMUMTYPICALMAXIMUMUNITS
 

 

 

 

 

 

 

 

 

Output Power

TX Power Level 0PTX0-33.5dBm
TX Power Level 1PTX1-29.0dBm
TX Power Level 2PTX2-17.9dBm
TX Power Level 3PTX3-16.4dBm
TX Power Level 4PTX4-14.6dBm
TX Power Level 5PTX5-13.1dBm
TX Power Level 6PTX6-11.4dBm
TX Power Level 7PTX7-9.9dBm
TX Power Level 8PTX8-8.4dBm
TX Power Level 9PTX9-6.9dBm
TX Power Level 10PTX10-5.5dBm
TX Power Level 11PTX11-4.0dBm
TX Power Level 12PTX12-2.6dBm
TX Power Level 13PTX13-1.4dBm
TX Power Level 14PTX140.4dBm
TX Power Level 15PTX152.5dBm
TX Power Level 16PTX164.6dBm
TX Power Level 17PTX176.2dBm
Power in 2nd harmonicOutput power step = 17 50Ω for typical value. PT for maximum value.PTX2-50dBm
Power in 3rd harmonicPTX3-60dBm
Power in 4th harmonicPTX4-60dBm
Deviation from the channel center

frequency

 

Δfc

-150150KHz
Frequency drift for any

packet length

Δfcpkt50KHz
Drift rateΔfc/ΔT400Hz/µs
Modulated Frequency

Deviation

Δfmod±250KHz
In-band spurious emissions, power transmitted outside the selected channel, at a frequency offset

foffs

|foffs| = 2MHz 

 

POUT (fc+foffs)

-20dBm
|foffs| ≥ 3MHz-30dBm

REGULATORY CERTIFICATIONS

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: This device may not cause harmful interference, and  this device must accept and interference received, including interference that may cause undesired operation. The 20028186 Module is modular certified and complies with the following regulatory requirements:

US FCC:
EMC

  •  FCC CFR 47, Part 15, Subpart B (10-1-17 Edition), Secs. 15.109
  •  FCC Part 15.247, 10-1-17 Edition: Operation within the bands 902 – 928MHz, 2400 – 2483.5MHz, and 5725 – 5850MHz.
  •  FCC Part 15.209, 10-1-17 Edition: Radiated emission limits; general requirements.

CANADA – IC

  •  ICES-003 Issue 6 – Update April (2017).
  •  RSS-247 Issue 2 (February 2017).
  •  RSS-Gen Issue 4 (November 2014).

CE
The module conforms with RED Radio Equipment Directive 2014/53/EU, following the provisions of ERP Directive 2009/125/EC, EU RoHS Directive 2011/65/EU, including the amendment 2015/863/EU.
EMC

  •  ETSI EN 301 489-1 V2.2.0
  •  ETSI EN 301 489-17 V3.2.0
  •  ETSI EN 300 328 v2.2.2 (2019-07)

ISED REFULATORY NOTICES

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with ISED license-exempt RSS(S). Operation is subject to the following two conditions:

  1. This device may not cause harmful interference.
  2.  This device must accept any interference received, including interference that may cause undesired operation.

ISED LABELLING REQUIREMENTS FOR HOST DEVICE
The host deice shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise, the host device must be labeled to display the IC of the module, preceded by the words “Contain transmitter module”, or the word “Contains”, or similar wording expressing the same meaning as follows: Contains IC: 23221-20028186

RF EXPOSURE SAFETY ISED
This device complies with the ISED RF exposure limits and has been evaluated in compliance with portable exposure condition. To comply with the measured SAR value/SAR testing exclusion, the equipment must be installed and operated with a minimum distance of 5 mm of the human body.

PERMITTED ANTENNA
Radio transmitter model, FCC ID: 2ANTU-20028186, has been approved by the FCC to operate with the antenna listed below with the maximum permissible gain indicated (below). Antenna types not listed below, or having a gain greater than the maximum gain indicated below, are strictly prohibited for use with this device.

Approved AntennaAntenna TypeMaximum Gain
Abracon AMCA31-2R450G-S1F-TSurface mount Chip0.5dBi

LABELING REQUIREMENTS
The module itself will have the following information displayed on its RF shield:

The label has the following contents:

  •  Model: 20028186
  •  FCC ID: 2ANTU-20028186
  •  IC ID: 23221-20028186
  •  FCC, CE, and RoHS markings
  •  Waterpik company name

In addition to the module labelling, the Host device shall properly label the end device to identify the modules within the host device. The certification label of the module shall be visible at all times when installed in the host device, or the host device must be labelled to display the IC of the module. The IC of the module must be preceded by the words “Contains transmitter module”, “Contains”, or similar wording to express similar meaning as: Contains FCC ID: 2ANTU-20028186

ENVIRONMENTAL SAFETY

The 20028186 is compliant with:

  •  RoHS, according to EU Directive 2011/65/EU and its amendments including 2015/863/EU
  •  Halogen-Free according to IEC 61249-2-21:2003
  •  REACH compliant according to EU Regulation 1907/2006

RF EXPOSURE SAFETY

This device complies with the FCC RF exposure limits and has been evaluated in compliance with portable exposure conditions. To comply with the measured SAR value/SAR testing exclusion, the equipment must be installed and operated with a minimum distance of 5 mm of the human body.

REFERENCE DOCUMENTS
EM9304 Device Specifications (Datasheet) Abracon LLC AMCA31-2R450G-S1F-T Datasheet

Documents / Resouces

Download manual
Here you can download full pdf version of manual, it may contain additional safety instructions, warranty information, FCC rules, etc.


Related Manuals