Hylintech Hlm9s82 Lora Wireless Module Owner's Manual

HLM9S82 LoRa Wireless Module

Product Information

Product Name: HYLINTECH HLM9S82

Product Type: LoRa Module

Description: The HLM9S82 wireless module is a high-performance
IoT wireless transceiver based on LoRa modulation. It utilizes
SEMTECH’s LLCC68 series RF integrated chip, which offers small
size, low power consumption, long transmission distance, and strong
anti-interference capability. The module provides a user-friendly
SPI interface, making it suitable for various IoT wireless
communication applications.

FCC ID: 2A4G5-HLM9S82

Features:

• Frequency Range: 902.3-927.7MHz
• LoRa Modulation
• Low Power Consumption
• Supply Voltage: 1.8V~3.6V
• Rx Mode Current: 5.3mA
• Sleep Mode Current: 1.2uA
• High Link Budget
• Tx Power: Up to 22.10dBm
• Rx Sensitivity: -129dBm at SF9BW125
• SPI Interface
• Module Size: 18.6*18.5*3.0mm

Product Usage Instructions

The HYLINTECH HLM9S82 LoRa module can be used in the following
applications:

• Metering
• Smart Home
• Remote Control
• Security

Specifications

Absolute Maximum Ratings:

General Specifications:

Pin Connection

Basic Operation

Typical Application Circuits:

When using the HLM9S82 module, it is recommended to include a
matching circuit between the module’s antenna interface and the
antenna interface. Two typical application circuits are shown
below:

PCB Layout Notes

1. The DIO port should be connected to the MCU’s IO port with
   external interrupt.
2. The trace between the RF port and the antenna should be as
   short as possible. The RF trace should be impedance matched
   (50Ω).
3. Add a matching circuit between the RF port and the antenna if
   possible.
4. Keep the antenna away from other devices.
5. Avoid proximity to high voltage circuits and high-frequency
   circuits.
6. Ensure proper grounding, preferably with a large area of
   paving.

HYLINTECH

HYLINTECH
HLM9S82 User Manual
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HYLINTECH
HLM9S82 Datasheet

915M LoRa Module

V1.3 Date2022/12/01 Datasheet

Discription
HLM9S82 wireless module is a LoRa modulation based high performance IoT wireless transceiver. The module is developed based on SEMTECH’s LLCC68 series RF integrated chip, which features small size, low power consumption, long transmission distance and strong anti-interference capability. HLM9S82 provides SPI interface, which is user-friendly and can be applied to various IoT wireless communication fields.
FCC ID: 2A4G5-HLM9S82

Features
902.3-927.7MHz LoRa Low power
– 1.8V~3.6V Supply voltage – 5.3mA Rx mode – 1.2uA Sleep Mode High link budget – Up to 22.10dBm Tx power – Rx sensitivity-129dBm@SF9BW125 SPI Interface

18.6*18.5*3.0 mm
Usage
Metering Smart Home Remote control Security

Order

PN

Range

HLM9S82 -40~+85

Size 18.6×18.5×3mm

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HYLINTECH
1 Specifications

Item
VDDV PmrdBm Tmr

Table1-1 Absolute Maximum Ratings

Range

Min

Max

-0.5

+3.8

Description Supply voltage

–

+10

RF Input level

-55

+125

Temperature

Table1-2 General Specifications

Item

VDDV

Top

Fa (kHz)

Fop (MHz)

Power Consumption

Tx (mA) Rx (mA) Sleep (uA)

Tx Power (dBm)

Rx Sensitivity (dBm)

Modem

Size (mm)

Range

Min

Typ

MAX

1.8

3.3

3.6

-40

–

85

-10

–

+10

902.3

–

927.7

120

–

–

5.3

–

–

1.2

–

–

–

22.10

–

-129

–

LoRa

18.6*18.6*3.0Fig-2-1

Description
Supply voltage below 3.3V causes a drop in maximum transmit power. The module does not operate when the supply voltage is below 1.8V. Operating temperature range Frequency accuracy Operating frequency band Max power Tx DC_DC mode SLEEP mode Supply voltage = 3.3V BW_L=125kHz , SF=9
GB/T1804-C

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HYLINTECH
2 Package Outline

Fig 2-1 HLM9S82 package outline
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HYLINTECH
3 Pin Connection

Pin Num

Pin Name

P1

GND

P2

RF

P3

GND

P4

SW_TX

P5

SW_RX

P6

DIO1

P7

DIO2

P8

DIO3

P9

NRST

P10 BUSY

P11 NSS

P12 MISO

P13 SCLK

P14 MOSI

P15 VDD

P16 GND

Table 3-1 Pin Description

Type

Description

(I = input

O = Output)

–

Ground

I/O

RF in and out

–

Ground

I

Switch Control , Tx mode : High LevelOther mode : Low Level

I

Switch Control , Rx mode : High LevelOther mode : Low Level

I/O

LLCC68’s DIO1

I/O

LLCC68’s DIO2

I/O

LLCC68’s DIO3

I

LLCC68’s NRESET

O

LLCC68’s BUSY

I

LLCC68’s NSS

O

LLCC68’s MISO

I

LLCC68’s SCLK

I

LLCC68’s MOSI

–

Power supply

–

Ground

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HYLINTECH
4 Basic Operation

4.1 Typical application circuits
When using the HLM9S82, users are advised to include a -matching circuit between the module’s antenna interface and the antenna interface, with the reference circuit structure shown in the diagram below. Fig4-1 is the optimum cost solution, requiring 11 IO ports; Fig42 is the minimum IO ports solution, requiring 8 IO ports.

Fig4-1 optimum cost solution

Antenna

Fig4-2 minimum IO ports solution
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Antenna

HYLINTECH
4.2 PCB Layout Notes

1 The DIO port is connected to the MCU’s IO port with external interrupt. 2 The Trace between the RF port and the antenna is as short as possible. the RF Trac
should be impedance matched (50). 3 Add -matching circuit between RF port and antenna if possible. 4 Keep the antenna away from other devices. 5 Keep away from high voltage circuits and high frequency circuits. 6 Ensure the quality of grounding, it is best to ensure a large area of paving.

4.3 SPI Interface

The SPI interface gives access to the configuration register via a synchronous full-duplex protocol corresponding to CPOL = 0 and CPHA = 0 in Motorola/Freescale nomenclature. Only the slave side is implemented.
An address byte followed by a data byte is sent for a write access whereas an address byte is sent and a read byte is received for the read access. The NSS pin goes low at the beginning of the frame and goes high after the data byte.
MOSI is generated by the master on the falling edge of SCK and is sampled by the slave (i.e. this SPI interface) on the rising edge of SCK. MISO is generated by the slave on the falling edge of SCK.
A transfer is always started by the NSS pin going low. MISO is high impedance when NSS is high.
The SPI runs on the external SCK clock to allow high speed up to 16MHz. For detailed information, please refer to the LLCC68 chip instruction manual.

Fig4-3 SPI Timing Diagram
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HYLINTECH
5 Additional Notes

5.1Power Supply
It is recommended to use a DC regulated power supply to power the HLM9S82 while keeping the power ripple as low as possible. HLM9S82 should be reliably grounded and the positive and negative terminals of the power supply should be properly connected, as reversing the connection may cause permanent damage to the module.
5.2 ESD
The module can pass the electrostatic test of contact discharge 4KV and air discharge 8KV. During air discharge, the arc is approximately 10cm from the module.
To avoid permanent damage to the device, all necessary ESD precautions should be taken.
5.4 Avoid using some frequencies
Since the HLM9S82 uses a 32MHz crystal, crystal’frequency is 902.3-927.7MHz. Users should avoid these frequencies (>1MHz) when using the HLM9S82.

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FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: –Reorient or relocate the receiving antenna. –Increase the separation between the equipment and receiver. –Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. –Consult the dealer or an experienced radio/TV technician for help.

OEM Guidance
1. Applicable FCC rules This device complies with part 15.247 of the FCC Rules. 2. The specific operational use conditions This module can be used in IoT devices. The input voltage to the module is nominally 3.3 V DC. The operational ambient temperature of the module is -40 °C ~ 85 °C. the external antenna is allowed, such as dipole antenna.
3. Limited module procedures N/A 4. Trace antenna design N/A

5. RF exposure considerations
The equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator and your body. If the equipment built into a host as a portable usage,
the additional RF exposure evaluation may be required as specified by 2.1093.
6. Antenna
Antenna type: Dipole antenna; Peak antenna gain : 1.03 dBi
7. Label and compliance information
An exterior label on OEM’s end product can use wording such as the
following: “Contains Transmitter Module FCC ID: 2A4G5-HLM9S82”
or “Contains FCC ID: 2A4G5-HLM9S82”
8. Information on test modes and additional testing requirements
6. The modular transmitter has been fully tested by the module grantee on the required number of channels,modulation types, and modes, it should not be necessary for the host installer to re-test all the available transmitter modes or settings. It is recommended that the host product manufacturer, installing the modular transmitter,perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits (e.g., where a different antenna may be causing additional emissions). 7. The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters, digital circuitry, or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a standalone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance. 8. If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference have been corrected .
9. Additional testing, Part 15 Sub part B disclaimer The final host / module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance
in KDB 996369. For host products with certified modular transmitter, the frequency range of investigation of the composite system is specified by rule in Sections 15.33(a)(1) through (a)(3), or the range applicable to the digital device, as shown in Section 15.33(b)(1), whichever is the higher frequency range of investigation When testing the host product, all the transmitters must be operating. The transmitters can be enabled by using publicly-available drivers and turned on, so the transmitters are active. In certain conditions it might be appropriate to use a technology-specific call box (test set) where accessory 50 devices or drivers are not available. When testing for emissions from the unintentional radiator, the transmitter shall be placed in the receive mode or idle mode, if possible. If receive mode only is not possible then, the radio shall be passive (preferred) and/or active scanning. In these cases, this would need to enable activity on the communication BUS (i.e., PCIe, SDIO, USB) to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add attenuation or filters depending on the signal strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4, ANSI C63.10 and ANSI C63.26 for further general testing details. The product under test is set into a link/association with a partnering device, as per the normal intended use of the product. To ease testing, the product under test is set to transmit at a high duty cycle, such as by sending a file or streaming some media content.