Renesas R9a06g062gnp Sub Ghz Wireless Communication Evaluation Kit User Manual

R9A06G062GNP/RTK0EE0013D10001BJ
Sub-GHz Wireless Communication Evaluation Kit For North America
User Manual

R9A06G062GNP Sub GHz Wireless Communication Evaluation Kit

All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by
Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information.
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General Precautions in the Handling of Micro processing Unit and Micro controller Unit Products
The following usage notes are applicable to all Micro processing unit and Micro controller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Precaution against Electrostatic Discharge (ESD)
   A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
   The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level at which resetting is specified.
3. Input of signal during power-off state
   Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
   Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible.
5. Clock signals
   After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
6. Voltage application waveform at input pin
   Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).
7. Prohibition of access to reserved addresses
   Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these addresses as the correct operation of the LSI is not guaranteed.
8. Differences between products
   Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems. The characteristics of a micro processing unit or microcontroller unit products in the same group but having a different part number might differ in terms of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system evaluation test for the given product.

How to Use This Manual

1. Purpose and Target Readers
   This manual is intended to give users an understanding of the basic specifications and correct usage of this product. This manual is intended for users who want to use this product to evaluate the MCU and debug programs. The readers of this manual are expected to have knowledge of the MCU functions and debuggers.
   Particular attention should be paid to the precautionary notes when using the manual. These notes occur within the body of the text, at the end of each section, and in the Usage Notes section.
   The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the text of the manual for details.
   The following documents apply to RTK0EE0013D10001BJ. Be sure to refer to the latest versions of these documents.
   The newest versions of the listed documents are available on the Renesas Electronics Web site.

   Document Type	Description	Document Title	Document No.
   User’s manual	RTK0EE0013D10001BJ hardware specifications	RTK0EE0013D10001BJ User’s Manual	R02UZ0004EJ (this manual)
   Design data	RTK0EE0013D10001BJ Circuit schematics Parts list	RTK0EE0013D10001BJ Circuit schematics Parts list	R02AN0047EJ
   User’s manual for R9A06G062GNP	Hardware specifications (pin assignments, peripheral function specifications, electrical characteristics, timing charts) and descriptions of operation	R9A06G062GNP Sub-GHz Transceiver User’s Manual: Hardware	R02UH0006EJ
   RX65N User’s manual for the hardware	Hardware specifications (pin assignments, memory maps, peripheral function specifications, electrical characteristics, timing charts) and descriptions of operation	RX65N Group User’s Manual: Hardware	R01UH0590EJ
   ISL80510 Datasheet	Hardware specifications (pin assignments, electrical characteristics) and descriptions of operation	ISL80510 Datasheet	FN8767
   ISL9005A Datasheet	Hardware specifications (pin assignments, electrical characteristics) and descriptions of operation	ISL9005A Datasheet	FN6452

Overview

1. 1 Package Components
Thank you for purchasing the Sub-GHz Wireless Communication Evaluation Kit from Renesas (hereinafter referred to as “this product”). This product consists of the Target Board for Sub-GHz Wireless Communication Evaluation Kit (RTK0EE0013D10001BJ)
1.2 Purpose
This product is an evaluation tool for a Sub-GHz Wireless Communication Solutions. This manual descries hardware specifications.
1.3 Features
This product includes the following features:

• Sub-GHz Wireless Communication evaluation
  This product offers sub-GHz wireless communication solutions with FCC of North America to help you easily start developing your application.

1.4 Sub-GHz Wireless Communication Evaluation Kit: Table of Specifications
Table 1-1 shows the specifications of this product.
Table 1-1: Sub-GHz Wireless Communication Evaluation Kit Specification Table

1.5 Block Diagram
Figure 1-1 shows the block diagram of this product.

External view

Figure 2-1 shows the external view of this product.

This product includes Sub-GHz wireless function.
The antenna of this product permanently glued with epoxy to the SMA connector and cannot be removed.
Note:
Never disassemble or remodel this product.
Never use an antenna other than the antenna provided with the product, as it violates the radio-related laws.

Parts Layout

Figure 3-1 shows the parts layout of this product.

Operating Environment

Figure 4-1 shows the operating environment of this product. Install “Virtual COM Port USB Driver” on the host PC. In addition, install the serial terminal software as it will be used for wireless evaluation.

4.1 Virtual COM Port USB Driver
If your PC is connected to the Internet, Windows Update will automatically install the latest driver. Please wait until you see the following pop-up message: Your device is ready to use. If you have not yet installed the driver on your PC, Download and install the driver. Virtual COM port drivers can be downloaded from the FTDI website. FTDI manufactures USB chips embedded in this product.
FTDI website: http://www.ftdichip.com/Drivers/VCP.htm

4.2 Serial Terminal Software
The serial terminal software enables data to be input to and output from a serial console.
The serial terminal settings are as shown in Table 4-1.
Table 4-1: Serial Terminal Settings

Note:
Windows does not come with serial terminal software. Please use the free terminal software of your choice.

User Circuits

5.1 DIP switch
Set the following when evaluating (normal mode).
Table 5-1: DIP switch Settings

Mode	DIP switch Settings
Evaluation (normal mode)

5.2 Connection of control MCU(RX65N) and wireless transceiver IC (CWX-M)
Table 5-2: Connection of control MCU(RX65N) and wireless transceiver IC (CWX-M)

*1 Reserved for option use.
*2 RX65N is master device.

Wireless evaluation

6.1 Serial terminal software connection settings

1. Connect the host PC and this product with a USB cable.
2. Check which COM port the USB of this product is assigned to using the device manager.
3. Start up the serial terminal software and set serial port.

6.2 Command specification

1. When the sample program is started, it enters “command menu mode” and is ready to accept commands.Table 6-1 shows the command list of sample program.
2. To execute the function of a command, enter the command and then press the return key. When the command has an argument, enter the command, a space and the argument, and then press the return key.

Table 6-1: Command list of sample program

• The gray areas are commands not supported by this product.
• The transmission output power setting of R9A06G062GNP is fixed to the following settings. It cannot be changed by command.
  FSK: 1.5 dBm OFDM: -2.0 dBm
• Details on the command specification is explained in the application note ” RF Characteristic Evaluation Program for Renesas Sub-GHz Transceiver Operation Manual (R30AN0376)”. Obtain the latest version of this document from the Renesas website.

Hardware specifications

Table 7-1 shows the communication specifications of this product.
Table 7-1: Communication specifications

7.1 North America Band
7.1.1 OFDM, Channel Spacing = 1200 KHz, Modulation = Option 1/MCS 6/2400 kbps

• Transmission output power at SMA connecter = +24 dBm
• Channel Number Setting: Chan Plan ID 5
  

  Channel number	Frequency [MH  z]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]
  0	903.2	1	904.4	2	905.6	3	906.8
  4	908.0	5	909.2	6	910.4	7	911.6
  8	912.8	9	914.0	10	915.2	11	916.4
  12	917.6	13	918.8	14	920.0	15	921.2
  16	922.4	17	923.6	18	924.8	19	926.0
  20	927.2

7.1.2 OFDM, Channel Spacing = 800 KHz, Modulation = Option 2/MCS 6/1200 kbps

• Transmission output power at SMA connecter = +24 dBm
• Channel Number Setting: Chan Plan ID 4
  

  Channel number	Frequency [MH  z]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]
  0	902.8	1	903.6	2	904.4	3	905.2
  4	906.0	5	906.8	6	907.6	7	908.4
  8	909.2	9	910.0	10	910.8	11	911.6
  12	912.4	13	913.2	14	914.0	15	914.8
  16	915.6	17	916.4	18	917.2	19	918.0
  20	918.8	21	919.6	22	920.4	23	921.2
  24	922.0	25	922.8	26	923.6	27	924.4
  28	925.2	29	926.0	30	926.8	31	927.6

7.1.3 OFDM, Channel Spacing = 400 KHz, Modulation = Option 3/MCS 6/600 kbps

• Transmission output power at SMA connecter = +24 dBm
• Channel Number Setting: Chan Plan ID 2
  

  Channel number	Frequency [MH  z]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]
  0	902.4	1	902.8	2	903.2	3	903.6
  4	904.0	5	904.4	6	904.8	7	905.2
  8	905.6	9	906.0	10	906.4	11	906.8
  12	907.2	13	907.6	14	908.0	15	908.4
  16	908.8	17	909.2	18	909.6	19	910.0
  20	910.4	21	910.8	22	911.2	23	911.6
  24	912.0	25	912.4	26	912.8	27	913.2
  28	913.6	29	914.0	30	914.4	31	914.8
  32	915.2	33	915.6	34	916.0	35	916.4
  36	916.8	37	917.2	38	917.6	39	918.0
  40	918.4	41	918.8	42	919.2	43	919.6
  44	920.0	45	920.4	46	920.8	47	921.2
  48	921.6	49	922.0	50	922.4	51	922.8
  52	923.2	53	923.6	54	924.0	55	924.4
  56	924.8	57	925.2	58	925.6	59	926.0
  60	926.4	61	926.8	62	927.2	63	927.6

7.1.4 OFDM, Channel Spacing = 200KHz, Modulation = Option 4/MCS 6/300 kbps

• Transmission output power at SMA connecter = +24 dBm
• Channel Number Setting: Chan Plan ID 1
  

  Channel number	Frequency [MH  z]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]
  0	902.2	1	902.4	2	902.6	3	902.8
  4	903.0	5	903.2	6	903.4	7	903.6
  8	903.8	9	904.0	10	904.2	11	904.4
  12	904.6	13	904.8	14	905.0	15	905.2
  16	905.4	17	905.6	18	905.8	19	906.0
  20	906.2	21	906.4	22	906.6	23	906.8
  24	907.0	25	907.2	26	907.4	27	907.6
  28	907.8	29	908.0	30	908.2	31	908.4
  32	908.6	33	908.8	34	909.0	35	909.2
  36	909.4	37	909.6	38	909.8	39	910.0
  40	910.2	41	910.4	42	910.6	43	910.8
  44	911.0	45	911.2	46	911.4	47	911.6
  48	911.8	49	912.0	50	912.2	51	912.4
  52	912.6	53	912.8	54	913.0	55	913.2
  56	913.4	57	913.6	58	913.8	59	914.0
  60	914.2	61	914.4	62	914.6	63	914.8
  64	915.0	65	915.2	66	915.4	67	915.6
  68	915.8	69	916.0	70	916.2	71	916.4
  72	916.6	73	916.8	74	917.0	75	917.2
  76	917.4	77	917.6	78	917.8	79	918.0
  80	918.2	81	918.4	82	918.6	83	918.8
  84	919.0	85	919.2	86	919.4	87	919.6
  88	919.8	89	920.0	90	920.2	91	920.4
  92	920.6	93	920.8	94	921.0	95	921.2
  96	921.4	97	921.6	98	921.8	99	922.0
  100	922.2	101	922.4	102	922.6	103	922.8
  104	923.0	105	923.2	106	923.4	107	923.6
  108	923.8	109	924.0	110	924.2	111	924.4
  112	924.6	113	924.8	114	925.0	115	925.2
  116	925.4	117	925.6	118	925.8	119	926.0
  120	926.2	121	926.4	122	926.6	123	926.8
  124	927.0	125	927.2	126	927.4	127	927.6
  128	927.8

7.1.5 FSK, Channel Spacing = 200KHz, 50 kbps/m = 1.0

• Transmission output power at SMA connecter = +30 dBm
• Channel Number Setting: Chan Plan ID 1
  

  Channel number	Frequency [MH  z]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]
  0	902.2	1	902.4	2	902.6	3	902.8
  4	903.0	5	903.2	6	903.4	7	903.6
  8	903.8	9	904.0	10	904.2	11	904.4
  12	904.6	13	904.8	14	905.0	15	905.2
  16	905.4	17	905.6	18	905.8	19	906.0
  20	906.2	21	906.4	22	906.6	23	906.8
  24	907.0	25	907.2	26	907.4	27	907.6
  28	907.8	29	908.0	30	908.2	31	908.4
  32	908.6	33	908.8	34	909.0	35	909.2
  36	909.4	37	909.6	38	909.8	39	910.0
  40	910.2	41	910.4	42	910.6	43	910.8
  44	911.0	45	911.2	46	911.4	47	911.6
  48	911.8	49	912.0	50	912.2	51	912.4
  52	912.6	53	912.8	54	913.0	55	913.2
  56	913.4	57	913.6	58	913.8	59	914.0
  60	914.2	61	914.4	62	914.6	63	914.8
  64	915.0	65	915.2	66	915.4	67	915.6
  68	915.8	69	916.0	70	916.2	71	916.4
  72	916.6	73	916.8	74	917.0	75	917.2
  76	917.4	77	917.6	78	917.8	79	918.0
  80	918.2	81	918.4	82	918.6	83	918.8
  84	919.0	85	919.2	86	919.4	87	919.6
  88	919.8	89	920.0	90	920.2	91	920.4
  92	920.6	93	920.8	94	921.0	95	921.2
  96	921.4	97	921.6	98	921.8	99	922.0
  100	922.2	101	922.4	102	922.6	103	922.8
  104	923.0	105	923.2	106	923.4	107	923.6
  108	923.8	109	924.0	110	924.2	111	924.4
  112	924.6	113	924.8	114	925.0	115	925.2
  116	925.4	117	925.6	118	925.8	119	926.0
  120	926.2	121	926.4	122	926.6	123	926.8
  124	927.0	125	927.2	126	927.4	127	927.6
  128	927.8

7.1.6 FSK, Channel Spacing = 400 KHz, 150 kbps/m = 0.5

• Transmission output power at SMA connecter = +30 dBm
• Channel Number Setting: Chan Plan ID 2
  

  Channel number	Frequency [MH  z]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]	Channel number	Frequency [MHz]
  0	902.4	1	902.8	2	903.2	3	903.6
  4	904.0	5	904.4	6	904.8	7	905.2
  8	905.6	9	906.0	10	906.4	11	906.8
  12	907.2	13	907.6	14	908.0	15	908.4
  16	908.8	17	909.2	18	909.6	19	910.0
  20	910.4	21	910.8	22	911.2	23	911.6
  24	912.0	25	912.4	26	912.8	27	913.2
  28	913.6	29	914.0	30	914.4	31	914.8
  32	915.2	33	915.6	34	916.0	35	916.4
  36	916.8	37	917.2	38	917.6	39	918.0
  40	918.4	41	918.8	42	919.2	43	919.6
  44	920.0	45	920.4	46	920.8	47	921.2
  48	921.6	49	922.0	50	922.4	51	922.8
  52	923.2	53	923.6	54	924.0	55	924.4
  56	924.8	57	925.2	58	925.6	59	926.0
  60	926.4	61	926.8	62	927.2	63	927.6

Additional Information

Technical Support
For details on the Transceiver IC (CWX-M), refer to the R9A06G062GNP Sub-GHz Transceiver User’s Manual: Hardware.
The latest information is available from the Web page.
Technical Contact Details
General information on Renesas micro controllers can be found on the Renesas website at: https://www.renesas.com/

Note

• Do not install this product into your product.
• When using this product, be sure to use the antenna provided with the product.
• Never disassemble or modify this product.
• Do not use any firmware other than the dedicated firmware for this product during wireless evaluation.

Trademarks
All brand or product names used in this manual are trademarks or registered trademarks of their respective companies or organisations.
Copyright
This document may be, wholly or partially, subject to change without notice. All rights reserved. Duplication of this document, either in whole or part is prohibited without the written permission of Renesas Electronics Corporation.
© 2022 Renesas Electronics Corporation. All rights reserved.

Certification of Compliance

This product complies with the laws and regulations described below.
9.1 Radio-Related Laws
North America: FCC ID: 2AEMXCWXMRTK1BJ
FCC Regulatory
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.

FCC CAUTION
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment has very low levels of RF energy that it deemed to comply without maximum permissive exposure evaluation (MPE). But it is desirable that it should be installed and operated keeping the radiator at least 20cm or more away from person’s body.
This equipment has been tested and meets the FCC RF exposure guidelines when used with the Renesas accessories supplied or designated for this product. Use of other accessories may not ensure compliance with FCC RF exposure guidelines.
This equipment must be used with the approved antenna included in the product.
The certified antenna include:
TERMINAL DIPOLE ANTENNA (Taoglas: TI.92.2113) with peak gain 2.14 dBi.
The antenna of this product permanently glued with epoxy to the SMA connector and cannot be removed.

Renesas Electronics Corporation
www.renesas.com
R02UZ0004EJ0100
R9A06G062GNP
RTK0EE0013D10001BJ User’s Manual
Publication Date: Rev.1.00 Dec.31.22
Published by: Renesas Electronics Corporation
Rev.1.00 2022.12
© 2022 Renesas Electronics Corporation. All rights reserved.