Ebyte E78-400m22s1c Lpwan Low Power Lora Wireless Soc User Manual

Ebyte E78-400m22s1c Lpwan Low Power Lora Wireless Soc User Manual

EBYTE E78-400M22S1C LPWAN Low Power LoRa Wireless SoC

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Introduction

Brief Introduction

E78 series are RF transceiver module of various frequency bands designed and manufactured by Chengdu Ebyte, with long communication distance and extremely low power mode current consumption. It is a small-sized SMD type (pin pitch 1. lmm).

EBYTE E78-400M22S1C LPWAN Low Power LoRa Wireless SoC

Features
  • The first domestic universal LPWAN wireless SoC module based on ASR6601SE;
  • Support LoRaWAN, LinkWAN multiple protocol standards;
  • Ultra-high sensitivity of -148 dBm and a maximum transmit power of 22 dBm;
  • Support 42 configurable GPIOs3xI2C1xICS4xUART1xLPUART1xSWD3xSPI1xQSPI 2xWDG;
  • 62.5Kbps air data rate under LoRa modulation, and 300Kbps under (G)FSK modulation;
  • Support the global license-free ISM 433MHz band, support 470MHz meter reading frequency band;
  • Support deep sleep, the power consumption of the whole machine is about 2uA in this mode;
  • The measured communication distance can reach 5.5km;
  • Built-in embedded LCD driver;
  • Support AES, DES, RSA, ECC, SHA, SM2/3/4 hardware encryption;
  • Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
  • IPEX and stamp hole optional, good for secondary development and integration.
Application
  • Street lamp control, environmental monitoring, etc;
  • Smart parking lot sensor;
  • Smart home and industrial sensors, etc.
  • Smart Agriculture Sensor;
  • Wireless alarm security system;
  • Building automation solutions;
  • Wireless industrial-grade remote control;
  • Health care products;
  • Advanced Meter Reading Architecture(AMI).

Specification and parameter

Specification
Model No.FrequencyTransmit powerReference distance(stamp hole/IPEX)PackageAntenna
E78-400M22S1C410-490MHz21dBm5.5Km(Lora 1kbps)SMDStamp/IPEX
Model No.ICSizeNet WeightOperation TemperatureOperation HumidityStorage Temperature
E78-400M22S1CASR6601S E26* 16*2.8 mm1.9g-40 ~ 85℃10% ~ 90%-40 ~ 125°C
Limit parameter
Main parameterPerformanceRemark
 MinMax 
Power supply(V)-0.33.9≥3.9 V ensures output power
Digital input level voltage(V)-0.33.9≥3.9 V ensures output power
Rf input power(dBm)+10Chances of burn is slim when modules are used in short distance
Temperature(℃)Storage: -55~+125Operating: -40~+85Industrial grade
Humidity(%)Storage: 5~95Operating: 10~95Without condensation
Operating parameter
Main parameterPerformanceRemark
MinTypeMax
Power supply(V)1.73.33.7 
Communication level(V)1.73.33.7 
TX Current (mA)105108110LoRa Pout=+22dBm
RC current (mA)8.58.711LoRa 125KHz DCDC Mode, MCU Operation, Build-in TCXO
Sleep current(uA)0.811MCU reserved
Sleep current(uA)1.61.81.8RF/MCU/RTC reserved
TX power (dBm)20.620.821Set up Pout=+22dBm
Recommended frequency (MHz)410433/470/490490Module working frequency 410~490MHz
Receiving sensitivity (dBm)-148 
TCXO crystal (MHz)32Built-in crystal oscillator and uses PWR_TCXO for power supply
TCXO crystal voltage(V)1.81.83.3Recommended output voltage of PWR_TCXO pin
AntennaIPEX/Stamp hole50 ohm impedance
Parameter description
  • When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the remaining amount, and the whole machine is conducive to long-term stable operation;
  • The current required for the inst ant of launch is large but often because the launch time is extremely short, the total energy consumed may be smaller;
  • When customers uses an external antenna, the impedance matching degree between the antenna and the module at different frequency points will affect the magnitude of the transmission current to varying degrees;
  • The current consumed by the RF chip in the pure receiving state is called the receiving current. Some RF chips with communication protocols or developers have loaded some self-developed protocols on the whole machine, which may cause the receiving current of the test to be too large;
  • The current in the purely receiving state is often mA level, and the “receiving current” of the μA level needs to be processed by the developer through software;
  • The shutdown current is often much smaller than the current consumed by the power supply part of the whole machine at no load, without being overly demanding;
  • Since the material itself has a certain error, a single LRC component has an error of +0.1%. However, since a plurality of LRC components are used in the entire RF loop, there is a case where error accumulation occurs, resulting in a difference in emission current and reception current of different modules;
  • Reducing the transmit power can reduce power consumption to some extent, but reducing the transmit power emissions for a number of reasons reduces the efficiency of the internal PA.

Size and pin definition

Pin No.ItemDirectionDescription
1GNDGround wire, connected to the power reference ground
2GNDGround wire, connected to the power reference ground
3GNDGround wire, connected to the power reference ground
4NCReserved
5GPIO01Input/OutputMCU GPIO
6GPIO00Input/OutputMCU GPIO
7GPIO03Input/OutputMCU GPIO
8GPIO02Input/OutputMCU GPIO
9GPIO06Input/OutputMCU GPIO
10GPIO07Input/OutputMCU GPIO
11NRSTInputExternal reset pin
12GPIO14Input/OutputMCU GPIO
13GPIO15Input/OutputMCU GPIO
14GPIO23Input/OutputMCU GPIO
15GPIO25Input/OutputMCU GPIO
16GPIO24Input/OutputMCU GPIO
17GPIO27Input/OutputMCU GPIO
18GPIO26Input/OutputMCU GPIO
19GPIO29Input/OutputMCU GPIO
20GNDGround wire, connected to the power reference ground
21GPIO28Input/OutputMCU GPIO
22GPIO30Input/OutputMCU GPIO
23GPIO31Input/OutputMCU GPIO
24GPIO62Input/OutputMCU GPIO
25UART0_RXInputMCU GPIO
26UART0_TXOutputMCU GPIO
27GPIO60Input/OutputMCU GPIO
28GPIO58Input/OutputMCU GPIO
29GPIO13Input/OutputMCU GPIO
30GPIO12Input/OutputMCU GPIO
31VCCPower supply, range 2.5V ~ 3.7V (recommended to add external ceramic filter capacitor)
32GNDGround wire, connected to the power reference ground
33GNDGround wire, connected to the power reference ground
34GPIO11Input/OutputMCU GPIO
35GPIO08Input/OutputMCU GPIO
36GPIO05Input/OutputMCU GPIO
37GPIO04Input/OutputMCU GPIO
38GPIO09Input/OutputMCU GPIO
39GPIO45Input/OutputMCU GPIO
40GPIO44Input/OutputMCU GPIO
41GPIO42Input/OutputMCU GPIO
42GPIO41Input/OutputMCU GPIO
43GPIO40Input/OutputMCU GPIO
44GPIO37Input/OutputMCU GPIO
45GPIO33Input/OutputMCU GPIO
46GPIO32Input/OutputMCU GPIO
47GPIO36Input/OutputMCU GPIO
48GPIO35Input/OutputMCU GPIO
49GPIO34Input/OutputMCU GPIO
50GNDGround wire, connected to the power reference ground
51ANTOutputAntenna interface, stamp hole (50 ohm characteristic impedance)
52GNDGround wire, connected to the power reference ground
★    For the pin definition,software driver and communication protocol of the module, please refer to ASR official 《ASR6601SE Datasheet》 ★

E78-400M22S1C development

  • In the process of software development, please be sure to follow ASR6601SE official user manual and related software development materials in detail, details see ASR official;
  • The E78-400M22S1C module has a built-in 32MHz TCXO. The crystal  power supply uses the PWR_TCXO pin ofthe ASR6601SE chip. The recommended voltage is 1.8V;
  • The module has a built-in external 32.768KHz crystal oscillator, and the load capacitance of the crystal oscillator is programmable inside the ASR6601SE chip
  • Module firmware download can use SWD and UART two ways, the pins are respectively.
    Download portPin description
    SWDGPIO06 (SWDATA), GPIO07 (SWCLK), NRST respectively are the 9th, 10th, and 11th pins
    SerialUART0_RX and UART0_TX respectively are the 25th and 26th pins
    Note: Use the official SDK, before starting to download, please connect GPIO02 to high level, then restart the module to enter the serial download mode.
  • The module integrates a radio frequency switch, which supports two modes of single control and dual control, see the table below for details:
    Operating modeGPIO10GPIO59Remark
    Transmit mode11Single control mode
    Receive mode10Single control mode
    Others: GPIO59 (LORA_RF_SWITCH) is the DIO2 pin with built-in RF. After the official SDK is modified to TCXO mode, it can be directly downloaded to the module for running test.

FAQ

Communication range is too short
  • The communication distance will be affected when obstacle exists;
  • Data lose rate will be affected by temperature, humidity and co-channel interference;
  • The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
  • Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
  • The signal will be affected when the antenna is near metal object or put in a metal case;
  • Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance);
  • The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the transmitting power;
  • Due to antenna quality or poor matching between antenna and module.
Module is easy to damage
  • Please check the power supply, ensure it is between the recommended  values, voltage exceed the maximum thanwill cause permanent damage to the module.
  • Please check the stability of power supply, the voltage cannot fluctuate too much.
  • Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic susceptibility.
  • Please ensure the humidity is within limited range, some parts are sensitive to humidity.
  • Please avoid using modules under too high or too low temperature.

Production guidance

Reflow soldering temperature
Profile FeatureCurve characteristicsSn-Pb AssemblyPb-Free Assembly
Solder PasteSolder pasteSn63/Pb37Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)Min preheating temp.100℃150℃
Preheat temperature max (Tsmax)Mx preheating temp.150℃200℃
Preheat Time (Tsmin to Tsmax)(ts)Preheating time60-120 sec60-120 sec
Average ramp-up rate(Tsmax to Tp)Average ramp-up rate3℃/second max3℃/second max
Liquidous Temperature (TL)Liquid phase temp.183℃217℃
Time(TL)Maintained Above(TL)Time below liquid phase line60-90 sec30-90 sec
Peak temperature(Tp)Peak temp.220-235℃230-250℃
Aveage ramp-down rate(Tp to Tsmax)Aveage ramp-down rate6℃/second max6℃/second max
Time 25℃ to peak temperatureTime to peak temperature for 25℃6 minutes max8 minutes max
Reflow soldering curve

Bulk packaging

Revision history

VersionDateDescriptionIssued by
1.02020/12/01Initial versionLinsoin

About us

Technical support: [email protected]
Documents and RF Setting download link: www.ebyte.com
Thank you for using Ebyte products! Please contact us with any questions or suggestions: [email protected]
————————————————————————————————-
Phone: +86 028-61399028
Web: www.ebyte.com
Address: B5 Mould Park, 199# Xiqu Ave, High-tech District, Sichuan, China

Chengdu Ebyte Electronic Technology Co.,Ltd. 11

References

Documents / Resouces

Download manual
Here you can download full pdf version of manual, it may contain additional safety instructions, warranty information, FCC rules, etc.


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