Leedarson La02301 Wi-fi And Bluetooth Smart Combo Module User Manual

Leedarson La02301 Wi-fi And Bluetooth Smart Combo Module User Manual

LEEDARSON LA02301 WI-FI and Bluetooth SMART Combo Module User Manual

 

Introduction

Overview

The LA02301 is a Leedarson-developed universal Wi-Fi and Bluetooth SMART (BLE) combo module. It uses the Espress if Inc. ESP32-U4WDH System in Package that integrates an embedded 4MB flash.
Product Overview
Figure 1.1. LA02301 Module

The LA02301 module is designed for a variety of IOT products such as Power Drivers, Sensors, Plugs, Lighting, Switches, etc.

  • Plug
    Product Applications
  • Switch
    Product Applications
  • Sensor
    Product Applications
  • Down Light
    Product Applications
  • Power Driver
    Product Applications
    Figure 1.2. Product Application
Key features
  • Embedded Xtensa® 32-bit LX6 microprocessor, with clock up to 160MHz
  • Data Memory: 520KB internal SRAM and 448KB internal ROM,4MB Flash
  • Power supply voltage: 3.0V 3.6V
  • Operating temperature: -40 105 Deg-C
  • Frequency of crystal oscillator: 40MHz\32.768KHz
  • Operating frequency: 2400 2483.5MHz
  • Support WIFI 802.11b/g/n up to 150Mbps Compliant with Bluetooth LE specifications Wi-Fi 802.11 b/g/n and BLE can’t transmission simultaneous
  • Interface:
    • Vertical Mount (Plug-In)
      • 5 PWMs (GPlOs)
      • 2 GPlOs
      • 1 Available UART
      • 1 ADC
      • 1 Dedicated Triac Dimmer Detection Pin
    • Horizontal (SMD)
    • 5 PWMs (GPlOs)
      • 4 GPlOs
      • 1 Available UART
      • 1 ADC
      • 1 Dedicated Triac Dimmer Detection Pin
Block Diagram

The LA02301 module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4GHz wireless connectivity and support Wi-Fi and BLE protocols.

Built around the ESP32-U4WDH Wireless SoC, the LA02301 includes a built-in PCB trace antenna, supply decoupling and filtering components, a 40MHz reference crystal, a 32.768 KHz crystal, and an RF shield. A general block diagram of the module is shown as below.
Block Diagram
Figure1.3, LA02301 Block Diagram

Power Supply

The LA02301 requires a single nominal supply level of 3.3V. All the necessary decoupling and filtering components are included in the module. The supply voltage noise tolerance of the module should be less than 100mVpp and the supply current should be more than SOOmA.

Module Certification Information

Table 1.1. Module Certification Information

ModuleCertification Type

Certification Information

LA02301

FCC2AB2Q-LA02301
IC

10256A-LA02301

Electrical characteristics

Absolute maximum ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any conditions above those indicated in the operation listing of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 2.1. Absolute maximum ratings

SymbolParameterMin.Max.

Units

VCCPower Supply-03
GNDGround of Module
VIOVoltage of Module IO-0.3+3.6V
Storage temperature-40+125Deg-C
MSLMoisture Sensitivity Level
ESD HBMHuman Body Mode1.5KV
ESD CDM Charge Device Mode500                 V
General Operating Conditions

This table specifies the general operating temperature range and supply voltage range for all supplies, the minimum and maximum values of all other tables are specified over this operating range, unless otherwise noted.

Table 2.2. General Operating Conditions

Symbol

ParameterMin.Typ.Max.

Units

VCCSupply voltage, normal3.03.33.6V
TAOperation temperature’-4025105Deg-C
ICCpeakSupply Current Peak2400450mA
ICC averageSuply Current average2150mA
Note:
  1. It refers in particular to the surface temperature on 40MHz reference crystal of the LA02301 when it is working, if the surface temperature of 40MHz reference crystal is above 105 Deg-C, the RF parameters will be worse.
  2. It is measured when the module runs the RF test Firmware @ 10% duty cycle and 25 Deg-C ambient temperature.
DC Specifications

Unless otherwise indicated, typical conditions are: VCC=3.3V.TA=25 Deg-C.

Table 2.3. DC Specifications

Symbol

Parameter(condition)Min.Typ.Max.

Units

VIHInput high voltage0.75xVCCC112VCCV
VILInput low voltageGND0.25xVCCV
VOHOutput high voltage0.8xVCCV
VOLOutput low voltage0.1xVCCV
IOHOutput high current40mA
IOLOutput low current28mA
RPUPull-up resistance45k Q
RPDPull-down resistance45k Q
ITX 802.11b peakTransmit 1 lb DSSS 1Mbps Pout=+19dBm382mA
ITX 802.11b averageTransmit llb DSSS 1Mbps Pout=+l9dBm148mA
ITX 802.11b peakTransmit 11b DSSS 11Mbps Pout=+19dBm378mA
ITX 802.11b averageTransmit l lb DSSS 11Mbps Pout=+19dBm146mA
ITX 802.11g peakTransmit l lg OFDM 6Mbps Pout=+l7dBm332mA
ITX 802.11g averageTransmit llg OFDM 6Mbps Pout=+l7dBm139mA
ITX 802.11g peakTransmit l lg OFDM 54Mbps Pout=+13 dBm272mA
ITX 802.11g averageTransmit llg OFDM 54Mbps Pout=+13 dBm130mA
ITX 802.11n peakTransmit 11n OFDM MCSO Pout=+17.5 dBm328mA
ITX 802.11n averageTransmit lln OFDM MCSO Pout=+17.5 dBm140mA
ITX 802.11n peakTransmit lln OFDM MCS7 Pout=+12 dBm256mA
ITX 802.11n averageTransmit lln OFDM MCS7 Pout=+12 dBm128ink
IRX 802.11b/g/nRx average current108mA
ITX BLEPout=8 dBm236mA
ITX BLE averagePout=8 dBm184mA
IRX BLERx average current115mA
Note: The current is measured with the module running the RF test Firmware @
RF Specifications

Unless otherwise indicated, typical conditions are: VCC=3.3V TA=25 Deg-C,

Table 2.4. Wi-Fi Specifications

Symbol

DescriptionMin.Typ.Max.

Units

FopOperating frequencies24122484MHz
1 lb DSSS 1Mbps output power19dBm
PRF1 lb
1 lb DSSS 11Mbps output power19dBm
11g OFDM 6Mbps output power17dBm
PRF11g
11g OFDM 54Mbps output power13dBm
11n OFDM HT20 MCSO output power17dBm
11n OFDM HT20 MCS7 output power12dBm
PRF1 ln
11n OFDM HT40 MCSO output power16dBm
11n OFDM HT40 MCS7 output power11dBm
Receiver sensitivity @1 lb DSSS 1Mbps-95dBm
Maximum receiving level @1 lb DSSS 1Mbps5dBm
PSENS1 lb
Receiver sensitivity @l lb DSSS 11Mbps-86dBm
Maximum receiving level @1 lb DSSS 11Mbps5dBm
Receiver sensitivity @llg OFDM 6Mbps-91dBm
Maximum receiving level @llg OFDM 6Mbps0dBm
PSENS11g
Receiver sensitivity @11g OFDM 54Mbps-73dBm
Maximum receiving level @1 1 g OFDM 54Mbps-8dBm
Receiver sensitivity @l in OFDM HT20 MCSO-90dBm
Maximum receiving level @11n OFDM HT20 MCSO0dBm
Receiver sensitivity @l In OFDM HT20 MCS7-71dBm
Maximum receiving level @l In OFDM HT20 MCS7-8dBm
PSENS1 in
Receiver sensitivity @l In OFDM HT40 MCSO-88dBm
Maximum receiving level @l In OFDM HT40 MCSO0dBm
Receiver sensitivity @l In OFDM HT40 MCS7-68dBm
Maximum receiving level @l In OFDM HT40 MCS7-8dBm

Table 2.5 BLE Specifications

Symbol

DescriptionMin.Typ.Max.

Units

FopOperating frequencies24022480MHz
LE Output Power8dBm
PRFLELE Out Power Control range24dB
LE Out Power Control step3dB
LE Receiver sensitivity-90dBm
PSENSLE
LE Maximum receiving level0dBm

Pin Definition

Pin Definition
Figure 3.1. Vertical Mount (Plug-In)

Table 3.1. Plug-In pin definition

Module No*Pin of ICPin DefinitionPin Function DescriptionDirection
11,3,4,19,26,37,4

3,46

VCCPower Supply
240UORXDRXOFACTORY_UART_RX data in (RX) ground of moduleI
349GND
441TX0FACTORY_UART_TX data out (TX)0
517_MTMSPWM1/I00PWM channel 1 output / GPIO 0I/O
614_GPI025RX1HOST_UART_TX (data in to ESP32) , needI
an external pull up
715_GPI026PWM2/I01PWM channel 2 output / GPIO 1I/O
816_GPI027TX1HOSTUART_RX (data out from ESP32) , need an external pull up0
920_MTCKPWM3/IO2PWM channel 3 output / GPIO 2I/O
1023105GPIO 5 and BM SEL for UART boot;

Default: weak pull up

I/O
1121_MTDOPWM4/103PWM Channel 4 output / GPIO 3; Default: weak pull upI/O
1236_GPI023106GPIO6I/O
1324_GPIO4PWM5/I04PWM Channel 5 output / GPIO 4;
Default: weak pull down
I/O
149_CHIP_PU/ResetReset, Low ActiveI
1510_VDET_1FACTORY MODEFACTORY MODE enable, low activeI
161 l_VDET_2AC_TRIAC_DETEC

T1

Triac Dimmer Detect 0 – VCC (0 – 3.3V)I
175_SENSOR_VPADCAnalog-to-Digital ConverterI
1849GNDground of module

Note: 1. AC_TRIAC_DETECT is used to detect if a device is powered through a triac dimmer and to determine the dimmer settings. The circuit that feeds this signal should give a scaled DC voltage representation of the average AC voltage integrated over approximately 200ms. If the triac is set to chop the AC waveform 50%, the AC_TRIAC_DETECT signal should be at 50% of VCC.If the triac dimmer is turned up completely, the AC waveform will be minimally chopped and the AC_TRIAC_DETECT signal should be at 100% of VCC.

Pin Definition
Figure 3.2. Horizontal (SMD)

Table 3.2. SMD pin definition

Module
No
Pin of IC Ai aPin DefinitionPin Function DescriptionDirection
11,3,4,19,26,37,43, 46VCCPower Supply
29_CHIP_PU/ResetReset, low activeI
3GNDGNDground of module
423_GPIOO105GPIO 5 and BM_SEL for UART boot;
Default: weak pull up
I/O
517_MTMSPWMI/100PWM channel 1 output / GPIO 0I/O
635GP1018107GPIO7I/O
715_GPIO26PWM2/101PWM channel 2 output / GPIO 1I/O
816_GPIO27TX1HOST_UART_RX (data out from ESP32), need an external pull up0
920_MTCKPWM3/IO2PWM channel 3 output / GPIO 2I/O
920_MTCKPWM3/IO2PWM channel 3 output / GPIO 21 0
1014_GPIO25RX1HOST_UART_TX (data in to ESP32), need an external pull upI
1121_MTDOPWM4/I03PWM channel 4 output / GPIO 3 Default: weak pull upI/O
121 l_VDET_2AC_TRIAC_DETEC

Ti

Triac Dimmer Detect 0 – VCC (0 – 3.3V)1
1324_013104PWM5/I04PWM Channel 5 output / GPIO 4;
Default: weak pull down
170
14GNDGNDground of module
1510_VDET _1FACTORY_MODE_

N

FACTORY MODE enable, Low Active1
1641_UOTXDTXOFACTORY_UART_TX data out (TX)0
175_SENSOR_VPADCAnalog-to-Digital ConverterI
1840_UORXDRXOFACTORY_UART_RX data in (RX)I
I942_GPIO21108GPIO8I/O
2036_GPIO23106GPIO6I/O
21GNDGNDground of module
22GNDGNDground of module
Note:
1. AC_TRIAC_DETECT is used to detect if a device is powered through a triac dimmer and to determine the dimmer settings. The circuit that feeds this signal should give a scaled DC voltage representation of the average AC voltage integrated over approximately 200ms. If the triac is set to chop the AC waveform 50%, the AC_TRIAC_DETECT signal should be at 50% of VCC.If the triac dimmer is turned up completely, the AC waveform will be minimally chopped and the AC_TRIAC_DETECT signal should be at 100% of VCC.

Package Specifications

Dimension

Dimension
Figure 4.1. Module Dimensions (Unit: mm)

PCB Pads Information

Perspective view

PCB Pads Information
Figure 4.2. Pad Size (Unit: mm)

Note:

  1. Shaded part is Antenna Trace.
  2. The sizes of pads on the component side are the same to the opposite side.
Plug-in Land pattern example

Plug-in Land pattern
Figure 4.3. Plug-in PCB Land Pattern (Unit: mm)

Note:
Please see below lay-out:
Plug-in Land pattern
Figure 4.4. Plug-in PCB Land Pattern (Unit: mm)

SMD Land pattern example

SMD Land pattern
Figure 4.5. SMD PCB Land Pattern (Unit: mm)

Note:
Shaded part is Antenna Trace.

Soldering Recommendations

Refer to below information for SMT temperature settings. Note that the number of times of reflow should not above 2 times.

Table 5.1. SMT temperature setting

Set points(°C)

Zone12345678910
Top140180190180180190245260265210
Bottom140180190180180190245260265210
Conveyor Speed (cm/min):130.0

Graph
Figure 5.1. SMT temperature setting curve

Declaration

FCC Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.
15.21
Note: The grantee is not responsible for any changes or modifications not expressly approved by the party responsible for compliance. Such modifications could void the user’s authority to operate the equipment.
15.105(b)
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help

RF exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body.

This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two Condition.

  1. This device may not cause interference.
  2. This device must accept any interference, including interference that may cause undesired operation of the device.

Host labeling requirement:”Contains transmitter module
FCC ID: 2AB2Q-LA02301″ and IC: 10256A-LA02301

 

Documents / Resouces

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